Thick Print Copper Technology Increases Thermal Reliability

摘要

To meet the increasing demands of the power electronics market for high reliability under harsh environmental conditions, designers are striving to maximize the thermal performance of high-power applications. Currently, direct bonded copper (DBC) is the principal technology used for building these circuits. However, DBC poses several disadvantages in the circuit building process. DBC has weaknesses in its thermal mechanical reliability and lacks the flexibility to allow multiple copper thicknesses for power and signal functions in the same design.