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Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

机译：铜硬币嵌入式印刷电路板的散热：制造，热仿真和可靠性

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This paper was accepted for publication in the journal Circuit World and the definitive published version is available at http://dx.doi.org/10.1108/CW-11-2014-0052.

机译：该论文已被接受在《电路世界》杂志上发表，权威的发表版本可在http://dx.doi.org/10.1108/CW-11-2014-0052上获得。

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作者
Chen Yuanming; Wang Shouxu; He Xuemei; He Wei; Silberschmidt Vadim V.; Tan Ze;
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年度 2015
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正文语种 en
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专利

1. Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability [J] . Chen Yuanming, Wang Shouxu, He Xuemei, Circuit World . 2015,第2期

机译：铜硬币嵌入式印刷电路板的散热：制造，热仿真和可靠性
2. Fabrication of Al-Based Metal Printed Circuit Board Having Excellent Heat Dissipation Characteristics Using Polyimide/AlN Powder and Evaluation of Thermal Resistance of Light-Emitting Diode Module [J] . Park Jung-Kab, Baek Seung-Bin, Park Jong-Hwan, Journal of nanoscience and nanotechnology . 2016,第10期

机译：聚酰亚胺/ AlN粉制备具有优良散热性能的铝基金属印制板及其发光二极管模块的热阻评估
3. Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization [J] . Shuo Xiao, Yang Zhao, Yuan Cao, Circuit World . 2015,第1期

机译：印刷电路板散热孔导热系数的计算方法及其优化
4. Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology [C] . Wessel Wits, Rob Legtenberg, Jan Mannak, International Conference on Electronics Manufacturing and Technology . 2006

机译：通过使用印刷电路板多层技术制造的板载热管热管理
5. Microstructure and mechanical properties of electroless copper and their influence on the reliability of printed-circuit boards. [D] . Lin, Kuanchih. 1990

机译：化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
6. Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms [O] . Philipp Nothdurft, Gisbert Riess, Wolfgang Kern 2019

机译：印刷电路板中的铜/环氧树脂接头：制造和界面破坏机制
7. Copper thickness and thermal reliability of microvias produced by laser- assisted seeding (LAS) process in printed circuit board (PCB) manufacture [O] . Leung ESW, Yung WKC 2001

机译：在印刷电路板（PCB）制造中通过激光辅助晶种（LAS）工艺产生的微孔的铜厚度和热可靠性

Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

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