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The Effect of AlN Buffer Layer on AlGaN/GaN/AlN Double-Heterostructure High-Electron-Mobility Transistor

机译:AlN缓冲层对AlGaN / GaN / AlN双异质结构高电子迁移率晶体管的影响

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摘要

Herein, the effect of crystal quality of AlN buffer layer on AlGaN/GaN/AlN double-heterostructure high-electron-mobility transistor (DH-HEMT) is investigated. The material quality of the GaN channel and the AlGaN barriers, such as the dislocation density and the interface roughness, deteriorates, and the 2D electron gas (2DEG) mobility decreases as the threading dislocation density (TDD) of the AlN buffer increases. It is also revealed that the thickness and the Al mole fraction of the AlGaN barrier are affected by the strain variation of the GaN channel depending on the TDD of the AlN buffer. The variation of the compressive strain of the GaN channel is responsible for the 2DEG density change by affecting the barrier condition and the piezoelectric polarization charge. Lowtemperature Hall effect measurement reveals that the interface roughness scattering is a dominant factor for the mobility of the DH-HEMT, which is ≈2–6 × 10~3 cm~2 (V s)~(-1).
机译:在此,研究了AlN缓冲层的晶体质量对AlGaN / GaN / AlN双异质结构高电子迁移率晶体管(DH-HEMT)的影响。 GaN沟道和AlGaN势垒的材料质量(例如,位错密度和界面粗糙度)变差,并且随着AlN缓冲液的螺纹位错密度(TDD)的增加,二维电子气(2DEG)迁移率降低。还揭示出,AlGaN势垒的厚度和Al摩尔分数受取决于AlN缓冲液的TDD的GaN沟道的应变变化的影响。 GaN通道压缩应变的变化是通过影响势垒条件和压电极化电荷而导致2DEG密度变化的原因。低温霍尔效应测量表明,界面粗糙度散射是DH-HEMT迁移率的主要因素,≈2-6×10〜3 cm〜2(V s)〜(-1)。

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