Reliability of Au/Al bonding in plastic packages for high temperature (200℃) and high current applications

摘要

In the automotive field the need exists to increase the maximum operating temperature of plastic packages from 150℃ to 180℃ and 200℃. One major concern is the lifetime of Au/Al bond under the combined effect of high temperature and high current. In this study the failure mechanisms have been investigated using different molding compounds and different finishing of bonding pads. For selected combinations of materials the lifetime increases up to 50 times compared to the current technology.