Au Wire Bonding in Plastic Packages: Reliability Improvements for High Temperature (200C) and High Current Applications

摘要

In automotive applications there is the necessity to increase the operating temperature of plastic packages up to 180C and 200C because the electronic components have to be mounted in direct contact to the object to control (engine, transmission...). One major concern is the lifetime of Au/Al bond under the combined effect of high temperature and high current. In this study the main failure mechanisms are shown and different levels of improvements are investigated, using molding compounds with different flame retardant chemistries and different finishing of bonding pads. For selected combinations of materials the lifetime at 200C increases 50 times compared to the current technology.