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Interface traps density-of-states as a vital component for hot-carrier degradation modeling

机译:接口捕获状态密度作为热载流子退化建模的重要组成部分

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摘要

We refine our approach for hot-carrier degradation modeling based on a thorough evaluation of the carrier energy distribution by means of a full-band Monte-Carlo simulator. The model is extended to describe the linear current degradation over a wide range of operation conditions. For this purpose we employ two types of interface states, either created by single- or by multiple-electron processes. These traps apparently have different densities of states which is important to consider when calculating the charges stored in these traps. By calibrating the model to represent the degradation of the transfer characteristics, we extract the number of particles trapped by both types of interface traps. We find that traps created by the single- and multiple-electron mechanisms are differently distributed over energy with the latter shifted toward higher energies. This concept allows for an accurate representation of the degradation of the transistor transfer characteristics.
机译:我们基于全频带蒙特卡洛模拟器对载流子能量分布的全面评估,完善了热载流子退化建模的方法。该模型得到扩展,以描述在宽范围的工作条件下的线性电流衰减。为此,我们采用两种类型的界面状态,分别由单电子或多电子过程创建。这些陷阱显然具有不同的状态密度,这在计算存储在这些陷阱中的电荷时必须考虑到。通过校准模型以表示传输特性的下降,我们提取了两种类型的界面阱所捕获的颗粒数量。我们发现,由单电子和多电子机制产生的陷阱在能量上的分布不同,后者朝更高的能量转移。该概念允许精确表示晶体管传输特性的下降。

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  • 来源
    《Microelectronics & Reliability》 |2010年第11期|p.1267-1272|共6页
  • 作者单位

    Institute for Microelectronics, TU Wien, Gusshausstrasse 27-29, A-1040 Vienna, Austria A.F.Ioffe Physical-Technical Institute, 26 Polytechnicheskaya Str., 194021 St.-Petersburg, Russia;

    rnChristian Doppier Laboratory for Reliability Issues in Microelectronics at the Institute for Microelectronics, TU Wien, Gusshausstrasse 27-29, A-1040 Vienna, Austria;

    rnInstitute for Microelectronics, TU Wien, Gusshausstrasse 27-29, A-1040 Vienna, Austria;

    rnInstitute for Microelectronics, TU Wien, Gusshausstrasse 27-29, A-1040 Vienna, Austria;

    rnInst. for Microel. and Circuit Theory, Bundeswehr University, Wemer-Heisenberg-Weg 39, 85577 Munich, Germany;

    rnProcess Development and Implementation Department, Austriamicrosystems AG, Unterpremstaetten, Austria;

    rnProcess Development and Implementation Department, Austriamicrosystems AG, Unterpremstaetten, Austria;

    rnProcess Development and Implementation Department, Austriamicrosystems AG, Unterpremstaetten, Austria;

    rnGlobal TCAD Solutions, Rudolf Saltinger Platz 1. A-1030 Vienna, Austria;

    rnGlobal TCAD Solutions, Rudolf Saltinger Platz 1. A-1030 Vienna, Austria;

    rnProcess Development and Implementation Department, Austriamicrosystems AG, Unterpremstaetten, Austria;

    rnProcess Development and Implementation Department, Austriamicrosystems AG, Unterpremstaetten, Austria;

    rnChristian Doppier Laboratory for Reliability Issues in Microelectronics at the Institute for Microelectronics, TU Wien, Gusshausstrasse 27-29, A-1040 Vienna, Austria;

    rnInstitute for Microelectronics, TU Wien, Gusshausstrasse 27-29, A-1040 Vienna, Austria;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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