首页> 外文期刊>Journal of Computational Electronics >Multi-scale strategy for high-k/metal-gate UTBB-FDSOI devices modeling with emphasis on back bias impact on mobility
【24h】

Multi-scale strategy for high-k/metal-gate UTBB-FDSOI devices modeling with emphasis on back bias impact on mobility

机译:高k /金属栅UTBB-FDSOI器件建模的多尺度策略,重点是反偏压对迁移率的影响

获取原文
获取原文并翻译 | 示例
           

摘要

Mobility in high-k/metal-gate Ultra-Thin Body and Box Fully Depleted SOI devices has been extensively investigated by means of multi-scale simulations and experimental data. Split-CV mobility measurements have been performed for various Interfacial Layer Equivalent Oxide Thickness allowing an investigation of the physical mechanisms responsible for the mobility degradation at high-k/Interfacial layer interface. The impact of the back bias on transport properties is investigated and mobility enhancement in the reverse regime (back gate inversion) is studied. A multi-scale simulation strategy is ranging from quantum Non-equilibrium Green's Functions to semi-classical Kubo Greenwood approach. These advanced solvers made possible a throughout calibration of empirical TCAD mobility models.
机译:高k /金属栅超薄体和盒式全耗尽SOI器件的移动性已通过多尺度模拟和实验数据进行了广泛研究。已对各种界面层等效氧化物厚度进行了Split-CV迁移率测量,从而可以研究造成高k /界面层界面处迁移率降低的物理机制。研究了背偏置对传输特性的影响,并研究了反向状态(背栅反型)中迁移率的提高。多尺度模拟策略的范围从量子非平衡格林函数到半经典久保格林伍德方法。这些先进的求解器使TCAD经验模型的整个校准成为可能。

著录项

  • 来源
    《Journal of Computational Electronics》 |2013年第4期|675-684|共10页
  • 作者单位

    STMicroelectronics, 850, rue J. Monnet, BP. 16. 38921 Crolles,France,IMEP-LAHC, M1NATEC, 3 Parvis Louis Neel, 38016 Grenoble,France,CEA-LETI. Campus MINATEC, 17 rue des Martyrs,38054 Grenoble, France,DIEGM, University of Udine, Via delle Scienze 208,33100 Udine, Italy;

    STMicroelectronics, 850, rue J. Monnet, BP. 16. 38921 Crolles,France;

    SP2M, UMR-E CEA/UJF-Grenoble 1,INAC, Grenoble, France;

    STMicroelectronics, 850, rue J. Monnet, BP. 16. 38921 Crolles,France;

    SP2M, UMR-E CEA/UJF-Grenoble 1,INAC, Grenoble, France;

    CEA-LETI. Campus MINATEC, 17 rue des Martyrs,38054 Grenoble, France;

    STMicroelectronics, 850, rue J. Monnet, BP. 16. 38921 Crolles,France;

    Laboratoire Hubert Curien (UMR 5516), Institut d'Optique,18 rue Benoit Lauras, 42000, Saint-Etienne, France;

    CEA-LETI. Campus MINATEC, 17 rue des Martyrs,38054 Grenoble, France;

    DIEGM, University of Udine, Via delle Scienze 208,33100 Udine, Italy;

    DIEGM, University of Udine, Via delle Scienze 208,33100 Udine, Italy;

    SP2M, UMR-E CEA/UJF-Grenoble 1,INAC, Grenoble, France;

    Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA, USA;

    Synopsys, Thurgauerstrasse 40, 8050 Zurich, Switzerland;

    Synopsys, Thurgauerstrasse 40, 8050 Zurich, Switzerland;

    STMicroelectronics, 850, rue J. Monnet, BP. 16. 38921 Crolles,France;

    STMicroelectronics, 850, rue J. Monnet, BP. 16. 38921 Crolles,France;

    DIEGM, University of Udine, Via delle Scienze 208,33100 Udine, Italy;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    UTBB-FDSOI devices; Split C-V mobility measurements; Back bias; NEGF; Multi-scale simulations; TCAD;

    机译:UTBB-FDSOI设备;分开的C-V迁移率测量背偏;NEGF;多尺度模拟;计算机辅助设计;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号