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Influence of the Total Ionizing Dose Irradiation on 130 nm Floating-body PDSOI NMOSFETs

机译:总电离剂量辐照对130nm浮体PDSOI NMOSFET的影响

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This paper investigates the impact of ionizing radiation on floating body effects for the 130 nm PDSOI NMOSFETs. It is shown that the floating body effects are restrained by the irradiation both for the core device and the input/output (I/O) device. For the core device, the second peak of the front gate transconductance which is known as the gate-induced floating body effect degrades with the incremental total dose. The decline of the second peak is ascribed to the impact of the radiation-induced leakage current, but not to the radiation-induced interface traps assisted recombination or the suppression of the electron valence band (EVB) tunneling. For the I/O device, the kink effect and the hysteresis effect in the output characteristic which are observed before irradiation become insignificant after irradiation. These phenomena are due to the fully depleted of the silicon film in the I/O device which is caused by the buried oxide charge trapping. In addition, a radiation-induced latch, which is result from the leakage current-induced impact ionization, is also observed in the I/O device.
机译:本文研究了130nm PDSOI NMOSFET的电离辐射对浮体效应的影响。示出了通过对核心设备和输入/输出(I / O)设备的照射来限制浮体效应。对于核心器件,前栅极跨导的第二个峰值(称为栅极引起的浮体效应)随着总剂量的增加而降低。第二个峰的下降归因于辐射诱导的泄漏电流的影响,而不是归因于辐射诱导的界面陷阱辅助的重组或电子价带(EVB)隧穿的抑制。对于I / O设备,在辐照之前观察到的输出特性中的扭结效应和滞后效应变得微不足道。这些现象归因于I / O设备中硅膜的完全耗尽,这是由掩埋氧化物电荷陷阱引起的。此外,在I / O设备中还观察到由泄漏电流引起的碰撞电离导致的辐射引起的闩锁。

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