Closer look at lead-free joints

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Closer look at lead-free joints

机译：仔细看看无铅接头

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The quest for knowledge about lead-free solder joints takes many forms. In this paper M.H. Biglari and F. Kox discuss their experimental process and results for assessing voiding in joints.

机译：对无铅焊点知识的寻求有多种形式。在本文中Biglari和F. Kox讨论了评估关节排空的实验过程和结果。

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《Electronics manufacture and test》 |2006年第3期|p.9-11|共3页
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正文语种 eng
中图分类无线电电子学、电信技术;
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专利

1. Influence of Joint Arrangement on the Fracture Behavior of Lead-Free Solder Joints [J] . Sadegh Mirmehdi, Amir Nourani, Mohammadmahdi Honarmand, Journal of Electronic Materials . 2021,第4期

机译：联合安排对无铅焊点骨折行为的影响
2. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints [J] . Lin Jian, Lei Yongping, Fu Hanguang, Journal of Electronic Materials . 2018,第3期

机译：应变率对无铅焊点的关节强度和失效模式的影响
3. Effect of Added Elements on Microstructures and Joint Strength of Lead-free Sn-Based Solder Joint Dispersed IMC Pillar [J] . YAWARA Hayashi, IKUO Shohji, YUSUKE Nakata, Materials science forum . 2017,第PTa3期

机译：添加元素对无铅锡基锡膏分散IMC柱组织和接头强度的影响
4. Lead-free Flux Effect in Lead-free Solder Joint Improvement [C] . Eu Poh Leng, Min Ding, Ibrahim Ahmad, International Conference on Electronics Manufacturing and Technology . 2006

机译：无铅焊料关节改善的无铅助焊剂效果
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. Preparation of Lead-free Composite Powder Solder Paste and Study on Reliability of Lead-free Solder Joint [O] . 王建 2012

机译：无铅复合粉末焊锡膏的制备及无铅焊点可靠性研究
8. NASA-DoD Lead-Free Electronics Project. DRAFT Joint Test Report [R] . Kessel, K. 2011

机译：Nasa-DoD无铅电子项目。联合测试报告草案

Closer look at lead-free joints

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