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Analysis on gate-oxide thickness dependence of hot-carrier-induced degradation in thin-gate oxide nMOSFET's

机译:薄栅极氧化物nMOSFET中热载流子引起的退化的栅极氧化物厚度依赖性分析

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The analysis indicates that a thinner gate oxide nMOSFET shows smaller degradation. Mechanisms for the smaller degradation were analyzed using a simple degraded MOSFET model. It was found that the number of the generated interface states is defined uniquely by the amount of peak substrate current, independently from the gate-oxide thickness. The major cause of the smaller degradation in the thinner gate-oxide device is smaller mobility degradation due to the generated interface states. The degraded mobility was measured and formulated. The smaller mobility degradation is explained by the difference between the vertical electric field dependence of the Coulomb scattering term and that of the phonon term under the inversion condition. The effect of a larger channel conductance, due to the larger inversion charges for the thinner gate-oxide device, is the secondary cause for the smaller degradation.
机译:分析表明,较薄的栅极氧化物nMOSFET表现出较小的退化。使用简单的退化MOSFET模型分析了较小退化的机理。已经发现,所产生的界面状态的数目由峰值衬底电流量唯一地定义,而与栅极氧化物厚度无关。较薄的栅极氧化物器件中较小的退化的主要原因是由于生成的界面状态而导致的较小的迁移率退化。测量并配制降低的迁移率。在反转条件下,库仑散射项与声子项的垂直电场相关性之间的差异解释了较小的迁移率降低。由于较薄的栅极氧化物器件的反向电荷较大,因此较大的沟道电导的影响是较小的劣化的第二个原因。

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