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A low cost and low power silicon npn bipolar process with NMOS transistors (ADRF) for RF and microwave applications

机译:具有NMOS晶体管(ADRF)的低成本,低功耗硅npn双极工艺,用于RF和微波应用

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A silicon bipolar process for RF and microwave applications, which features 25-GHz double-polysilicon self-aligned npn bipolar transistors with 5.5-V BV/sub CEO/, optional 0.7-/spl mu/m (L/sub eff/) NMOS transistors with p/sup +/ polysilicon gates for switch applications, lateral pnp transistors, high and low valued resistors, p/sup +/ polysilicon-to-n/sup +/ plug capacitors, and inductors is described. The npn transistors utilize nitride-oxide composite spacers formed using sacrificial TEOS spacers, a process which is simpler than the previously reported composite spacer processes. Use of the composite spacer structure virtually eliminates problems relating to the extrinsic-intrinsic base link-up and reduces plasma induced damage associated with the conventional spacer process. Microwave and RF capabilities of the process up to several GHz are demonstrated by fabricating and characterizing RF amplifiers, low noise amplifiers, and RF switches.
机译:一种用于射频和微波应用的硅双极工艺,具有25-GHz双多晶硅自对准npn双极晶体管,具有5.5V BV / sub CEO /,可选0.7- / spl mu / m(L / sub eff /)NMOS描述了用于开关应用的具有p / sup + /多晶硅栅极的晶体管,横向pnp晶体管,高值和低值电阻器,p / sup + /多晶硅至n / sup + /插入电容器以及电感器。 npn晶体管利用使用牺牲TEOS间隔物形成的氮化物-氧化物复合间隔物,该过程比先前报道的复合间隔物过程更简单。复合隔离物结构的使用实际上消除了与外在-内在基础连接有关的问题,并减少了与常规隔离物工艺相关的等离子体引起的损坏。通过制造和表征RF放大器,低噪声放大器和RF开关,证明了该过程的微波和RF能力高达几个GHz。

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