首页> 美国卫生研究院文献>Materials >Investigation of Rapid Low-Power Microwave-Induction Heating Scheme on the Cross-Linking Process of the Poly(4-vinylphenol) for the Gate Insulator of Pentacene-Based Thin-Film Transistors
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Investigation of Rapid Low-Power Microwave-Induction Heating Scheme on the Cross-Linking Process of the Poly(4-vinylphenol) for the Gate Insulator of Pentacene-Based Thin-Film Transistors

机译:并五苯薄膜晶体管栅绝缘子的聚(4-乙烯基苯酚)交联过程的快速低功率微波感应加热方案研究

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摘要

In this study, a proposed Microwave-Induction Heating (MIH) scheme has been systematically studied to acquire suitable MIH parameters including chamber pressure, microwave power and heating time. The proposed MIH means that the thin indium tin oxide (ITO) metal below the Poly(4-vinylphenol) (PVP) film is heated rapidly by microwave irradiation and the heated ITO metal gate can heat the PVP gate insulator, resulting in PVP cross-linking. It is found that the attenuation of the microwave energy decreases with the decreasing chamber pressure. The optimal conditions are a power of 50 W, a heating time of 5 min, and a chamber pressure of 20 mTorr. When suitable MIH parameters were used, the effect of PVP cross-linking and the device performance were similar to those obtained using traditional oven heating, even though the cross-linking time was significantly decreased from 1 h to 5 min. Besides the gate leakage current, the interface trap state density (Nit) was also calculated to describe the interface status between the gate insulator and the active layer. The lowest interface trap state density can be found in the device with the PVP gate insulator cross-linked by using the optimal MIH condition. Therefore, it is believed that the MIH scheme is a good candidate to cross-link the PVP gate insulator for organic thin-film transistor applications as a result of its features of rapid heating (5 min) and low-power microwave-irradiation (50 W).
机译:在这项研究中,系统地研究了一种拟议的微波感应加热(MIH)方案,以获取合适的MIH参数,包括室压,微波功率和加热时间。提出的MIH意味着通过微波辐射可以快速加热聚(4-乙烯基苯酚)(PVP)膜下面的铟锡氧化物(ITO)金属,并且加热的ITO金属栅极可以加热PVP栅极绝缘体,从而导致PVP交叉链接。发现随着腔室压力的减小,微波能量的衰减减小。最佳条件是50 W的功率,5分钟的加热时间和20 mTorr的腔室压力。当使用合适的MIH参数时,即使交联时间从1 h显着减少到5 min,PVP交联的效果和器件性能也与使用传统烤箱加热获得的效果相似。除栅极泄漏电流外,还计算了界面陷阱态密度(Nit),以描述栅极绝缘体和有源层之间的界面状态。可以通过使用最佳MIH条件在PVP栅极绝缘体交联的器件中找到最低的界面陷阱态密度。因此,由于其快速加热(5分钟)和低功率微波辐照(50分钟)的特性,相信MIH方案是交联有机薄膜晶体管应用的PVP栅极绝缘体的良好选择。 W)。

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