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A comprehensive study of hot-carrier induced interface and oxide trap distributions in MOSFETs using a novel charge pumping technique

机译:使用新型电荷泵技术全面研究MOSFET中热载流子诱导的界面和氧化物陷阱的分布

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摘要

A novel simulation-independent charge pumping (CP) technique is employed to accurately determine the spatial distributions of interface (N/sub it/) and oxide (N/sub 0t/) traps in hot-carrier stressed MOSFETs. Direct separation of N/sub it/ and N/sub 0t/ is achieved without using simulation, iteration, or neutralization. Better immunity from measurement noise is achieved by avoiding numerical differentiation of data. The technique is employed to study the temporal buildup of damage profiles for a variety of stress conditions. The nature of the generated damage and trends in its position are qualitatively estimated from the internal electric field distributions obtained from device simulations. The damage distributions are related to the drain current degradation and well-defined trends are observed with the variations in stress biases and stress time. Results are presented which provide fresh insight into the hot-carrier degradation mechanisms.
机译:一种新颖的独立于仿真的电荷泵(CP)技术用于精确确定热载流子MOSFET中界面(N / sub it /)和氧化物(N / sub 0t /)陷阱的空间分布。 N / sub it /和N / sub 0t /的直接分离无需使用模拟,迭代或中和即可实现。通过避免数据的数值微分,可以更好地抵抗测量噪声。该技术用于研究各种应力条件下的损伤轮廓的时间累积。从器件仿真获得的内部电场分布定性地估计了产生的损伤的性质及其位置趋势。损伤分布与漏极电流的下降有关,并且随着应力偏置和应力时间的变化观察到明确的趋势。提出的结果为热载流子降解机理提供了新的见解。

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