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Two-Dimensional Analytical Threshold Voltage Model of Nanoscale Fully Depleted SOI MOSFET With Electrically Induced S/D Extensions

机译:带有电感应S / D扩展的纳米级全耗尽SOI MOSFET的二维分析阈值电压模型

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摘要

A new analytical model for the surface potential and the threshold voltage of a silicon-on-insulator (SOI) MOSFET with electrically induced shallow source/drain (S/D) junctions is presented to investigate the short-channel effects (SCEs). Dividing the SOI MOSFETs silicon thin film into three zones, the surface potential is obtained by solving the two-dimensional Poissons equation. Our model includes the effects of the body doping concentration, the lengths of the side and main gates and their work functions, applied drain and substrate biases, the thickness of the gate and buried oxide, and also the silicon thin film. Our model results reaffirm that the application of induced S/D extensions to the SOI MOSFET will successfully control the SCEs for channel lengths even less than 50 nm. Two-dimensional simulation results are used to verify the validity of this model, and quite good agreements are obtained for various cases.
机译:提出了一种新的分析模型,用于电绝缘浅源极/漏极(S / D)结的绝缘体上硅(SOI)MOSFET的表面电势和阈值电压,以研究短沟道效应(SCE)。将SOI MOSFET硅薄膜分为三个区域,通过求解二维泊松方程获得表面电势。我们的模型包括体掺杂浓度,侧栅极和主栅极的长度及其功函数,施加的漏极和衬底偏置,栅极和掩埋氧化物的厚度以及硅薄膜的影响。我们的模型结果再次证明,将感应S / D扩展应用于SOI MOSFET将成功控制SCE的沟道长度甚至小于50 nm。二维仿真结果用于验证该模型的有效性,并且在各种情况下都获得了很好的一致性。

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