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Dependence of Device Structures on Latchup Immunity in a High-Voltage 40-V CMOS Process With Drain-Extended MOSFETs

机译:器件结构对带有漏极扩展MOSFET的高压40V CMOS工艺中闩锁抗扰度的依赖性

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The dependence of device structures on latchup immunity in a 0.25-$mu hbox{m}$ high-voltage (HV) 40-V CMOS process with drain-extended MOS (DEMOS) transistors has been verified with silicon test chips and investigated with device simulation. Layout parameters such as anode-to-cathode spacing and guard ring width are also investigated to find their impacts on latchup immunity. It was demonstrated that the drain-extended NMOS with a specific isolated device structure can greatly enhance the latchup immunity. The proposed test structures and simulation methodologies can be applied to extract safe and compact design rule for latchup prevention of DEMOS transistors in HV CMOS process.
机译:硅测试芯片已验证了器件结构对采用漏极扩展MOS(DEMOS)晶体管的0.25-μmuhbox {m} $高压(HV)40-V CMOS工艺中的闩锁抗扰性的依赖性,并已通过硅测试芯片进行了验证,并进行了器件研究模拟。还研究了布局参数,例如阳极到阴极的间距和保护环的宽度,以发现它们对闩锁抗扰性的影响。事实证明,具有特定隔离器件结构的漏极扩展NMOS可以极大地增强闩锁免疫力。所提出的测试结构和仿真方法可以应用于提取安全紧凑的设计规则,以防止HV CMOS工艺中DEMOS晶体管的闩锁。

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