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On the Correct Extraction of Interface Trap Density of MOS Devices With High-Mobility Semiconductor Substrates

机译:高迁移率半导体衬底MOS器件界面陷阱密度的正确提取

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“Conventional” techniques and related capacitance-voltage characteristic interpretation were established to evaluate interface trap density on Si substrates. We show that blindly applying these techniques on alternative substrates can lead to incorrect conclusions. It is possible to both under- and overestimate the interface trap density by more than an order of magnitude. Pitfalls jeopardizing capacitance– and conductance–voltage characteristic interpretation for alternative semiconductor MOS are elaborated. We show how the conductance method, the most reliable and widely used interface trap density extraction method for Si, can be adapted and made reliable for alternative semiconductors while maintaining its simplicity.
机译:建立了“常规”技术和相关的电容-电压特性解释,以评估Si衬底上的界面陷阱密度。我们表明,盲目地将这些技术应用于替代性基材可能导致错误的结论。低估和高估界面陷阱密度可能超过一个数量级。阐述了危害替代半导体MOS的电容和电导-电压特性解释的陷阱。我们展示了电导方法(最可靠,使用最广泛的硅界面陷阱密度提取方法)如何在保持其简单性的同时,适用于替代半导体并使其变得可靠。

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