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A Combined Interface and Border Trap Model for High-Mobility Substrate Metal–Oxide–Semiconductor Devices Applied to and InP Capacitors

机译:适用于InP电容器和高迁移率衬底金属-氧化物-半导体器件的组合界面和边界陷阱模型

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By taking into account simultaneously the effects of border traps and interface states, the authors model the alternating current capacitance–voltage ($C$– $V$) behavior of high-mobility substrate metal–oxide–semiconductor (MOS) capacitors. The results are validated with the experimental $hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}/breakhbox{high-}kappa$ and InP/high-$kappa$ ( $C$–$V$) curves. The simulated $C$–$V$ and conductance–voltage ($G$– $V$) curves reproduce comprehensively the experimentally measured capacitance and conductance data as a function of bias voltage and measurement frequency, over the full bias range going from accumulation to inversion and full frequency spectra from 100 Hz to 1 MHz. The interface state densities of $hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ and InP MOS devices with various high-$kappa$ dielectrics, together with the corresponding border trap density inside the high-$kappa$ oxide, were derived accordingly. The derived interface state densities are consistent to those previously obtained with other measurement methods-n-n. The border traps, distributed over the thickness of the high- $kappa$ oxide, show a large peak density above the two semiconductor conduction band minima. The total density of border traps extracted is on the order of $hbox{10}^{19} hbox{cm}^{-3}$. Interface and border trap distributions for InP and $hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ interfaces with high-$kappa$ oxides show remarkable similarities on an energy scale relative to the vacuum reference.
机译:通过同时考虑边界陷阱和界面状态的影响,作者对高迁移率衬底金属-氧化物-半导体(MOS)电容器的交流电容-电压($ C $-$ V $)行为进行了建模。使用实验性$ hbox {In} _ {0.53} hbox {Ga} _ {0.47} hbox {As} / breakhbox {high-} kappa $和InP / high- $ kappa $($ C $ – $ V $)曲线。模拟的$ C $-$ V $和电导-电压($ G $-$ V $)曲线全面地再现了从累积起的整个偏置范围内,实验测量的电容和电导率数据随偏置电压和测量频率的变化情况。从100 Hz到1 MHz的反转和全频谱。具有各种高k介电常数的$ hbox {In} _ {0.53} hbox {Ga} _ {0.47} hbox {As} $和InP MOS器件的界面状态密度,以及高位内部相应的边界陷阱密度相应地得到了​​-氧化钾。导出的界面状态密度与先前使用其他测量方法-n-n所获得的一致。边界陷阱分布在高κ氧化物的厚度上,在两个半导体导带最小值以上均显示出较大的峰密度。提取的边界陷阱的总密度约为$ hbox {10} ^ {19} hbox {cm} ^ {-3} $。 InP和$ hbox {In} _ {{0.53} hbox {Ga} _ {0.47} hbox {As} $的界面和边界陷阱分布与高k氧化物的界面在能量规模上相对于真空参比显示出显着相似性。

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