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High-Performance Indium–Gallium–Zinc Oxide Thin-Film Transistors Based on Anodic Aluminum Oxide

机译:基于阳极氧化铝的高性能铟-镓-氧化锌薄膜晶体管

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Thin-film transistors (TFTs) based on indium–gallium–zinc oxide (IGZO) active layer and anodic aluminum oxide $(hbox{Al}_{2}hbox{O}_{3})$ gate dielectric were investigated. The anodic $hbox{Al}_{2}hbox{O}_{3}$ gate dielectric possesses low leakage current and relatively high dielectric constant. The IGZO TFT based on anodic $hbox{Al}_{2}hbox{O}_{3}$ shows a mobility of as high as 21.6 $hbox{cm}^{2}/hbox{V}cdothbox{s}$, an on/off current ratio of as high as $hbox{10}^{8}$, and a threshold voltage of only 2 V. Further studies show that the anodic $hbox{Al}_{2}hbox{O}_{3}$ gate dielectric is very compatible with the IGZO semiconductor, and both the channel resistance and contact resistance are lower than those of the TFTs based on thermally grown $ hbox{SiO}_{2}$ gate dielectric.
机译:研究了基于铟镓锌氧化物(IGZO)有源层和阳极氧化铝$(hbox {Al} _ {2} hbox {O} _ {3})$栅极电介质的薄膜晶体管(TFT)。阳极$ hbox {Al} _ {2} hbox {O} _ {3} $栅极电介质具有低泄漏电流和相对较高的介电常数。基于阳极$ hbox {Al} _ {2} hbox {O} _ {3} $的IGZO TFT显示出高达21.6 $ hbox {cm} ^ {2} / hbox {V} cdboxbox {s}的迁移率$,开/关电流比高达$ hbox {10} ^ {8} $,阈值电压仅为2V。进一步的研究表明,阳极$ hbox {Al} _ {2} hbox {O } _ {3} $栅极电介质与IGZO半导体非常兼容,并且沟道电阻和接触电阻均低于基于热生长的$ hbox {SiO} _ {2} $栅极电介质的TFT。

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