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The Oppositely Doped Islands IGBT Achieving Ultralow Turn Off Loss

机译:相反掺杂的孤岛IGBT实现超低关断损耗

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An oppositely doped islands insulated gate bipolar transistor (ODI-IGBT) is investigated for the first time. By adding one or several ODIs in the drift longitudinally equidistantly, the ODI-IGBT obtains a better electric field distribution than the field-stop IGBT (FS-IGBT) at OFF-state, which means a larger breakdown voltage. Moreover, at inductive load turn off transient, its space charge region is wider along with the better electric field distribution. Hence, less excess carriers are left when the anode voltage rises to the bus voltage. That is, its current decaying time is smaller than FS-IGBT, so does the turn off loss. Compared with the FS-IGBT in TSUPREM4 simulation, the ODI-IGBT can achieve a much lower turn off loss, which is only 52% of that of the FS-IGBT at the same breakdown voltage and same ON-state voltage. In addition, theODI-IGBT has a simplermanufacturingprocess and better immunity to process deviation than the super junction IGBT (SJ-IGBT).
机译:首次研究了相反掺杂的岛绝缘栅双极型晶体管(ODI-IGBT)。通过在纵向上等距地在漂移中添加一个或几个ODI,ODI-IGBT可获得比处于截止状态的场截止IGBT(FS-IGBT)更好的电场分布,这意味着更大的击穿电压。而且,在感性负载关断瞬态时,其空间电荷区域更宽,电场分布更好。因此,当阳极电压上升到总线电压时,剩余的剩余载流子更少。也就是说,其电流衰减时间小于FS-IGBT,因此关断损耗也较小。与TSUPREM4仿真中的FS-IGBT相比,ODI-IGBT可以实现低得多的关断损耗,在相同的击穿电压和相同的导通状态电压下,其损耗仅为FS-IGBT的52%。此外,与超结型IGBT(SJ-IGBT)相比,ODI-IGBT具有更简单的制造工艺和更好的抗工艺偏差性。

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