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Temperature dependent DC characteristics of an InP/InGaAs/InGaAsP HBT

机译:InP / InGaAs / InGaAsP HBT的温度相关直流特性

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We report the DC characteristics of n-p-n InP/InGaAs/InGaAsP HBT's which have a composite-collector structure designed to improve the breakdown and gain. The devices exhibit common-emitter current gain of greater than 8 for over 9 orders of magnitude of collector current and breakdown voltages greater than 10 V. The DC gain for a typical device decreases from 40 at room temperature to 8 at 90 K. Over the same temperature range the collector-current ideality factor increases from 1.04 to 1.46, and the base current ideality factor is 0.05 to 0.1 larger than these values. We suggest that the high collector-current ideality factor and the lower gain at the lower temperatures is due to the increasing importance of tunneling of current across the emitter-base junction. The devices with the InGaAs/InGaAsP composite-collector structure offer better common-base turn-on behavior than those with InGaAs/InP as the collector structure, without the breakdown behavior being compromised.
机译:我们报告了n-p-n InP / InGaAs / InGaAsP HBT的直流特性,该直流特性具有旨在改善击穿和增益的复合集电极结构。该器件在9个数量级以上的集电极电流和大于10 V的击穿电压下表现出大于8的共射极电流增益。典型器件的DC增益从室温下的40降低到90 K时的8。在相同温度范围内,集电极电流理想因数从1.04增加到1.46,而基本电流理想因数比这些值大0.05至0.1。我们认为,较高的集电极电流理想因数和较低温度下的较低增益是由于电流跨发射极-基极结隧穿的重要性日益增加。具有InGaAs / InGaAsP复合收集器结构的器件比以InGaAs / InP作为收集器结构的器件具有更好的共基导通性能,而不会影响击穿性能。

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