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Impacts of Notched-Gate Structure on Contact Etch Stop Layer (CESL) Stressed 90-nm nMOSFET

机译:缺口栅结构对接触蚀刻停止层(CESL)应力90nm nMOSFET的影响

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In this letter, mobility improvements by stress contact etch stop layer (CESL) in a strained 90-nm nMOSFET, with and without notched-gate structure, were studied in detail. Compared to the conventional vertical gate, a device with notched gate shows an extra 7% NMOS $I_{scriptstyle{rm ON}}$ enhancement for the increased stress in the channel region and the less effect of the halo-implanted impurity on channel. Both simulations with TCAD software and measurements confirm that the notched-gate structure efficiently enhances the generation of high tensile stress on the channel region from the CESL and more localized pocket implant.
机译:在这封信中,详细研究了具有和不具有缺口栅结构的应变90 nm nMOSFET中应力接触蚀刻停止层(CESL)对迁移率的改善作用。与传统的垂直栅极相比,具有缺口栅极的器件显示出额外的7%的NMOS $ I_ {scriptstyle {rm ON}} $增强,这是因为沟道区中的应力增加,而卤素注入杂质对沟道的影响较小。使用TCAD软件进行的仿真和测量均证实,带槽口的栅极结构有效地增强了CESL和更局限的袋状植入物在通道区域上产生高拉应力的能力。

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