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Investigation of Threshold Voltage Distribution Temperature Dependence in 3D NAND Flash

机译:3D NAND闪存中阈值电压分布温度依赖性的研究

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摘要

The impact of temperature on array Vth distribution was investigated in 3D NAND flash. Cell Vth distributions were obtained under different program and read temperature splits. After the page is programmed under high temperature, it is found that the high tail of Vth distribution exhibits a larger shift than the low tail, during read at different temperatures (85 degrees C and -25 degrees C). On the contrary, the low tail of Vth distribution shows a larger shift than the high tail during cross temperature read, after the page programmed under low temperature. The temperature coefficient (Tco) of cell Vth shows cell to cell variations, which can be categorized into two types. For type (1), the Tco is correlated with the selected cell Vth due to polysilicon channel. For type (2), the Tco is independent of the selected cell Vth. The corresponding impacts on Vth distribution are studied via array Monte Carlo simulation. Based on the simulation results, the above temperature dependent observations can be well modeled by the combination of both Tco variation type (1) and (2). Furthermore, two optimization approaches are proposed to alleviate the Vth distribution broadening and are validated by experiments.
机译:在3D NAND闪存中研究了温度对阵列Vth分布的影响。在不同的程序和读取的温度分割下获得细胞Vth分布。在高温下对页面进行编程之后,发现在不同温度(85摄氏度和-25摄氏度)下的读取过程中,Vth分布的高尾比低尾具有更大的偏移。相反,在低温下编程的页面之后,在交叉温度读取期间,Vth分布的低尾部显示出比高尾部更大的偏移。电池Vth的温度系数(Tco)显示了电池到电池的变化,可以分为两种类型。对于类型(1),由于多晶硅沟道,Tco与所选单元Vth相关。对于类型(2),Tco独立于所选单元格Vth。通过阵列蒙特卡洛模拟研究了对Vth分布的相应影响。根据模拟结果,可以通过组合Tco变化类型(1)和(2)很好地模拟上述与温度相关的观测结果。此外,提出了两种优化方法来缓解Vth分布展宽,并通过实验进行了验证。

著录项

  • 来源
    《IEEE Electron Device Letters》 |2019年第2期|204-207|共4页
  • 作者单位

    Univ Chinese Acad Sci, Beijing 100049, Peoples R China|Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China|Yangtze Memory Technol Co Ltd, Wuhan 430205, Hubei, Peoples R China;

    Univ Chinese Acad Sci, Beijing 100049, Peoples R China|Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China|Yangtze Memory Technol Co Ltd, Wuhan 430205, Hubei, Peoples R China;

    Yangtze Memory Technol Co Ltd, Wuhan 430205, Hubei, Peoples R China;

    Yangtze Memory Technol Co Ltd, Wuhan 430205, Hubei, Peoples R China;

    Univ Chinese Acad Sci, Beijing 100049, Peoples R China|Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China;

    Univ Chinese Acad Sci, Beijing 100049, Peoples R China|Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China;

    Yangtze Memory Technol Co Ltd, Wuhan 430205, Hubei, Peoples R China;

    Yangtze Memory Technol Co Ltd, Wuhan 430205, Hubei, Peoples R China;

    Yangtze Memory Technol Co Ltd, Wuhan 430205, Hubei, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China;

    Univ Chinese Acad Sci, Beijing 100049, Peoples R China|Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China|Yangtze Memory Technol Co Ltd, Wuhan 430205, Hubei, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Temperature dependence; polysilicon; array simulation; Vth distribution; 3D NAND flash;

    机译:温度依赖性;多晶硅;阵列仿真;Vth分布;3D NAND闪存;

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