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Novel High-Energy-Efficiency AlGaN/GaN HEMT with High Gate and Multi-Recessed Buffer

机译:具有高栅极和多凹槽缓冲器的新型高能效AlGaN / GaN HEMT

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摘要

A novel AlGaN/GaN high-electron-mobility transistor (HEMT) with a high gate and a multi-recessed buffer (HGMRB) for high-energy-efficiency applications is proposed, and the mechanism of the device is investigated using technology computer aided design (TCAD) Sentaurus and advanced design system (ADS) simulations. The gate of the new structure is 5 nm higher than the barrier layer, and the buffer layer has two recessed regions in the buffer layer. The TCAD simulation results show that the maximum drain saturation current and transconductance of the HGMRB HEMT decreases slightly, but the breakdown voltage increases by 16.7%, while the gate-to-source capacitance decreases by 17%. The new structure has a better gain than the conventional HEMT. In radio frequency (RF) simulation, the results show that the HGMRB HEMT has 90.8%, 89.3%, and 84.4% power-added efficiency (PAE) at 600 MHz, 1.2 GHz, and 2.4 GHz, respectively, which ensures a large output power density. Overall, the results show that the HGMRB HEMT is a better prospect for high energy efficiency than the conventional HEMT.
机译:提出了一种新型的具有高栅极和多凹槽缓冲(HGMRB)的AlGaN / GaN高电子迁移率晶体管(HEMT),用于高能效应用,并使用技术计算机辅助设计研究了该器件的机理。 (TCAD)Sentaurus和高级设计系统(ADS)模拟。新结构的栅极比势垒层高5 nm,缓冲层在缓冲层中有两个凹陷区域。 TCAD仿真结果表明,HGMRB HEMT的最大漏极饱和电流和跨导略有下降,但击穿电压却增加了16.7%,而栅-源电容减小了17%。新结构比常规HEMT具有更好的增益。在射频(RF)仿真中,结果表明HGMRB HEMT在600 MHz,1.2 GHz和2.4 GHz时分别具有90.8%,89.3%和84.4%的功率附加效率(PAE),从而确保了大输出功率密度。总体而言,结果表明,与传统的HEMT相比,HGMRB HEMT具有更高的能效前景。

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