首页> 外文期刊>Journal of Computational Electronics >Simulation design of a high-breakdown-voltage p-GaN-gate GaN HEMT with a hybrid AlGaN buffer layer for power electronics applications
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Simulation design of a high-breakdown-voltage p-GaN-gate GaN HEMT with a hybrid AlGaN buffer layer for power electronics applications

机译:用于电力电子应用的Hybrid Algan缓冲层的高击穿电压P-Gan-Gate GaN HEMT的仿真设计

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摘要

We propose a novel GaN high-breakdown-voltage high-electron-mobility transistor (HB-HEMT) with a p-GaN gate and hybrid AlGaN buffer to improve the breakdown voltage and Baliga's figure of merit. The hybrid AlGaN buffer is composed of a horizontally arranged Al_aGa_(1-a)N zone and an Al_bGa_(1-b)N zone, each having different Al compositions a and b. The proposed HB-HEMT is simulated using the Silvaco technology computer-aided design (TCAD) tool ATLAS, considering the polarization model, low-field mobility, high-field mobility, and Selberherr's impact ionization model to simulate the direct-current (DC), breakdown, and C-V properties of the proposed HB-HEMT. The breakdown voltage of the HB-HEMT is significantly improved by introducing the hybrid AlGaN buffer structure, which can effectively modulate the electric field distributions within the channel and the buffer. A high breakdown voltage (1450 V), a low specific on-state resistance (0.47 mΩ cm~2), and a high Baliga's figure of merit (4.47 GW/cm~2) are obtained at the same time with an L_(gd) (gate-to-drain distance) of 6 μm, a distance from the gate to the Al_aGa_(1-a)N/Al_bGa_(1-b)N interface of 4 μm, and Al compositions of a = 0.25 and b = 0.1. The simulated C-V results also reveal that the GaN HB-HEMT shows better switching characteristics than the conventional GaN HEMT with a p-GaN gate.
机译:我们提出了一种新型GaN高击穿 - 电压高电子迁移率晶体管(HB-HEMT),具有P-GaN栅极和杂交AlGaN缓冲液,以改善击穿电压和Baliga的优点。杂化AlGaN缓冲液由水平排列的Al_Aga_(1-A)n区和Al_bga_(1-B)n区组成,每个区域具有不同的Al组合物A和B.使用Silvaco技术计算机辅助设计(TCAD)工具图集模拟所提出的HB-HEMT,考虑到偏振模型,低场移动性,高场移动和Selberherr的影响电离模型来模拟直流(DC)提出的HB-HEMT的击穿和CV特性。通过引入混合动力ALGAN缓冲结构,可以有效地调制通道内的电场分布和缓冲器的击穿电压显着改善。高击穿电压(1450 V),低特定的导通电阻(0.47mΩcm〜2),同时使用L_(GD)同时获得高BALIGA的优点(4.47 GW / cm〜2)获得)(栅极到排水距离)为6μm,距栅极到Al_aga_(1-a)n / al_bga_(1-b)n界面的距离为4μm,Al组合物为= 0.25和b = 0.1。模拟的C-V结果还揭示了GaN HB-HEMT显示比具有P-GaN门的传统GaN HEMT更好的切换特性。

著录项

  • 来源
    《Journal of Computational Electronics》 |2020年第4期|1527-1537|共11页
  • 作者

    Yong Liu; Qi Yu; Jiangfeng Du;

  • 作者单位

    State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    GaN; HEMT; Hybrid AlGaN buffer; On-state resistance; Breakdown voltage;

    机译:甘姑娘;HEMT;杂交Algan缓冲;导通抗性;击穿电压;

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