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Comparison of side-gate modulation responses for AlGaN/GaN HEMTs on GaN substrates with and without C-doped GaN buffer layer

机译:GaN衬底与无C掺杂GaN缓冲层的GaN衬底侧栅调制响应的比较

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GaN HEMTs have promising potential as power transistors because of the excellent properties of GaN such as high carrier concentration, and high breakdown electric field. For optimum HEMT performance of GaN HEMT on GaN substrate, high-quality GaN substrates and buffers with high resistivities are important. However, unintentional residual impurities incorporated during growth results undoped GaN layer with low resistivity. In order to increase the resistivity, these impurities are compensated by doping the GaN with deep acceptors like carbon (C). In our previous works, we have reported that HEMT on C-doped GaN buffer showed a large modulation by side-gate (SG) measurement, and showed a hysteresis feature2) when bi-directional dual sweep SG measurement is done. In this report, we extend the study for SG measurements on two GaN HEMT devices with C-doped GaN buffer and no-buffer device.
机译:由于GaN,如高载体浓度,高击穿电场,GaN Hemts具有电力晶体管具有很强的电位。 对于GaN衬底上GaN Hemt的最佳HEMT性能,高质量的GaN基板和具有高电阻性的缓冲器很重要。 然而,在生长期间掺入的无意的残留杂质在增长结果中未掺杂的GaN层具有低电阻率。 为了提高电阻率,通过掺杂具有碳(C)的深层受体的GaN来补偿这些杂质。 在我们以前的作品中,我们报道了C掺杂GaN缓冲器上的HEMT通过侧栅(SG)测量显示了大的调制,并且在完成双向双扫描SG测量时,并显示滞后特征2)。 在本报告中,我们在具有C掺杂GaN缓冲器和No-Buffer设备的两个GaN HEMT设备上扩展了SG测量的研究。

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