新型晶体平面精密研磨抛光机的设计

摘要

针对现有抛光机不能纠正晶片厚度偏斜和晶片研磨厚度无法自动控制问题，设计了一种新型抛光机，该设备主要由抛光盘及其驱动装置和工件的固定调节装置部分组成，通过控制载套的上部凸缘与载套座的上表面的距离可以控制研磨晶片的厚度，通过更换砝码有效地控制研磨压力，通过载套与滚针轴承的配合有效地控制晶片的平行度，防止样品磨偏。该设备还可以用于陶瓷，金属，玻璃等材料的研磨抛光。%In view of the thickness deviation of crystal can't be corrected and the grinding thickness of crystal can't be controlled automatically by the existing polishing machine, a new type of polishing machine is de-signed. This device is mainly composed of polishing disk and its drive and the fixed device and adjusting de-vice of the workpiece . The thickness of the grinding crystal can be controlled by controlling the distance be-tween the upper flange of the carrier and the upper surface of the carrier block. The grinding pressure can be controlled effectively by changing the weights. The parallelism of the crystal plate can be controlled and the sample will be parallel after grinding . The device also can be effectively used for the grind and polish of ce-ramic, metal, glass and other materials.