晶圆级封装的优化散热分析

摘要

The finite element analysis software ANSYS was used to analyze and simulate an IC with wafer level packaging. The effects of the air convection coefficient, the environment temperature, the substrate thickness and the distance between soldering ball on the chip thermal resistance were discussed. The simulation results show that, based on comprehensive consideration of cost and heat dissipation,etc, 25×10–6W/(mm·℃) of air convection coefficient,0.10 mm of substrate thickness and 0.5 mm of soldering ball pitch are the suitable parameters to reach optimal effect in producing.%通过有限元分析软件ANSYS，对一款晶圆级封装的产品进行有限元分析仿真，讨论了空气对流系数、环境温度、基板厚度、焊球间距等因素对芯片热阻的影响。结果表明：考虑成本、散热等综合因素，选择空气对流系数为25×10–6W/(mm·℃)基板厚度为0.10 mm、焊球间距为0.5 mm为最优参数，可满足实际生产需要。