FEM stress analysis in BGA components subjected to JEDEC drop test applying high strain rate lead-free solder material models

摘要

The influence of the strain rate dependent yield properties of solder is often neglected in the FEM analyses of JEDEC drop tests. In this paper the effect of this material behavior was tested in drop test simulations of productive BGA components, in order to evaluate the resulting stress distribution and levels in the 2^nd level interconnects.