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Electronics System-Integration Technology Conference
Electronics System-Integration Technology Conference
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1.
Numerical Study on Impact of Mechanical Stress in the Regions of High Current Density in N-Type MOS Devices
机译:
N型MOS装置中高电流密度区域对机械应力影响的数值研究
作者:
Masaaki Koganemaru
;
Naohiro Tada
;
Torn Ikeda
;
Noriyuki Miyazaki
;
Hajime Tomokage
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
regions;
simulation;
distribution;
2.
Concept of Spatially-Divided Deep Reactive Ion Etching of Si using Oxide Atomic Layer Deposition in the Passivation Cycle
机译:
钝化循环中氧化物原子层沉积Si的空间划分深反应离子蚀刻的概念
作者:
F. Roozeboom
;
B. Kniknie
;
R. Knaapen
;
M. Smets
;
A. Illiberi
;
P. Poodt
;
G. Dingemans
;
W. Keuning
;
W.M.M. Kessels
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
fluorocarbon;
interconnects;
passivation;
3.
Numerical Simulation and Experimental Verification of Copper Plating with Different Additives for Through Silicon Vias
机译:
通过硅通孔用不同添加剂的铜电镀数值模拟及实验验证
作者:
Chongshen Song
;
Heng Wu
;
Xiangmeng Jing
;
Fengwei Dai
;
Daquan Yu
;
Lixi Wan
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
optimization;
behaviors;
verification;
4.
Electromigration Failure Analysis of Flip-Chip Solder Joint by using Void Growth Simulation and Synchrotron Radiation X-Ray M icrotomog-aphy
机译:
使用void生长模拟倒装芯片焊接接头的电迁移失效分析和同步辐射X射线ICOROTOMOG-APHY
作者:
Hisashi TANIE
;
Shinichi FUJIWARA
;
Nobuhiko CHIWATA
;
Masaru FUJIYOSHI
;
Hiroshi SHINTANI
;
Yu HARUBEPPU
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
electromigration;
simulation;
radiation;
5.
Assembly of a-Quartz for Surface Acoustic Wave (SAW) Strain Gauges Application
机译:
用于表面声波(SAW)应变仪应用的A - 石英组装
作者:
Jochen Hempel
;
Elena Zukowski
;
Michael Berndt
;
Leonhard M. Reindl
;
Jürgen Wilde
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
simulations;
topology;
sections;
6.
Thick Film 3-D Electrode Configuration for Electrochemical Applications
机译:
电化学应用的厚膜3-D电极配置
作者:
Martin Adamek
;
Michal Stekovic
;
Ivan Szendiuch
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
solution;
dimensions;
systems;
7.
First Approach to Cost-Efficient Fine Pitch NCA Flip-Chip Assembly on Thermoplastic Polyurethane Printed Circuit Boards
机译:
首先是在热塑性聚氨酯印刷电路板上的经济高效细间距NCA倒装芯片组件的方法
作者:
Philipp Foerster
;
Christian Dils
;
Christine Kallmayer
;
Thomas Loher
;
Klaus-Dieter Lang
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
Low-cost flip-chip assembly;
Thinned FC;
Thermoplastic polyurethane;
NCA bonding;
Stretchable circuit board;
TMA;
DMA;
FIB;
Assembly yield;
Reliability;
Repairable interconnection;
Component recycling.;
8.
Micro-Fabrication as Enabler for Sub-μm Photonic Alignment
机译:
微制造作为子μm光子对准的推动器
作者:
Marcel Tichem
;
Johan F. C. van Gurp
;
Tjitte-Jelte Peters
;
Vincent A. Henneken
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
fabrication;
components;
discusses;
9.
Chip/Package Interactions on advanced Flip-Chip packages: Mechanical Investigations on Copper pillar bumping
机译:
高级倒装芯片封装上的芯片/包装相互作用:铜柱撞击机的机械调查
作者:
S. Gallois-Garreignot
;
V. Fiori
;
C. Moutin
;
C. Tavernier
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
behavior;
integration;
interactions;
10.
Isotropic Conductive Adhesive Filled with Metal-coated Polymer Spheres - Effects of Metal Coating on Rheological and Mechanical Properties
机译:
填充有金属涂覆的聚合物球体的各向同性导电粘合剂 - 金属涂层对流变和机械性能的影响
作者:
Hoang-Vu Nguyen
;
Helge Kristiansen
;
Rolf Johannessen
;
Erik Andreassen
;
Nils Hoivik
;
Knut E. Aasmundtveit
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
minor;
effects;
present;
11.
Reinforced Performance of Lead-free Sn-8Zn-3Bi Solder With Doping of 0.03 wt. C_(60) on Cu Pads
机译:
在Cu垫上加强无铅Sn-8Zn-3Bi焊料的铅,掺杂0.03重量%。%C_(60)
作者:
Xiao Hu
;
Pei Qin
;
Y. C. Chan
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
fracture;
addition;
dispersion;
12.
New Probabilistic Reliability Model Describing the Risk of Chip Fracture in the Chip-On-Board Technology
机译:
新的概率可靠性模型,描述了芯片板上技术中芯片骨折的风险
作者:
Matthias Steiert
;
Jürgen Wilde
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
subsequent;
constructions;
electron;
13.
Thermosonic Bonding for Ultrasound Transducers: Low-temperature Metallurgical Bonding
机译:
用于超声换能器的热循环键合:低温冶金键合
作者:
Knut E. Aasmundtveit
;
Thi Thuy Luu
;
Trym Eggen
;
Charles E Baumgartner
;
Nils Hoivik
;
Kaiying Wang
;
Hoang-Vu Nguyen
;
Kristin Imenes
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
temperatures;
thermosonic;
transducers;
14.
Reliability of silkscreen printed planar capacitors and inductors under accelerated thermal cycling and humidity bias life testing
机译:
加速热循环和湿度偏置寿命测试下丝网印刷平面电容器和电感的可靠性
作者:
Juha-Veikko Voutilainen
;
Tuomas Happonen
;
Juha H?kkinen
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
deterioration;
criterion;
indication;
15.
Development of Embedded Power Electronics Modules
机译:
开发嵌入式电力电子模块
作者:
Lars Boettcher
;
Stefan Karaszkiewicz
;
Dionysios Manessis
;
Andreas Ostmann
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
3D packaging;
embedded components;
embedded actives and passives;
PCB technology;
System in Package;
power electronics;
16.
Fusion of Acoustic and X-ray Image Features for Solder Joint Through-life Monitoring during Thermal Cycling Tests
机译:
隔音和X射线图像特征的融合,用于热循环试验期间焊接接头常规监测
作者:
Ryan S.H. Yang
;
David M. Harvey
;
Guang-Ming Zhang
;
Derek R.Braden
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
features;
inspection;
manufacture;
17.
Ageing behavior of printed flexible resistors by thermal, mechanical and electrical stresses
机译:
热轧,机电应力印刷柔性电阻的老化行为
作者:
Detlef Bonfert
;
Dieter Hemmetzberger
;
Gerhard Klink
;
Karlheinz Bock
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
Flexible Film Resistors;
Thermal;
mechanical and electrical stress;
Transmission Line Pulsing;
Pulsed Stress.;
18.
A Built-in Test Circuit for Supply Current Testing of Open Defects at Interconnects in 3D ICs
机译:
一种内置测试电路,用于在3D IC中互连的开放缺陷电流测试
作者:
Tomoaki Konishi
;
Hiroyuki Yotsuyanagi
;
Masaki Hashizume
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
simulation;
interconnect;
architecture;
19.
Influence of liner-system and Cu-layer thickness on the grain structure of electroplated Cu
机译:
衬里 - 系统和Cu层厚度对电镀Cu晶粒结构的影响
作者:
M. Mueller
;
J. Kriz
;
D. Meinhold
;
T. Zerna
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
results;
orientation;
subsequent;
20.
Development of Wearable Medical System for Dehydration Detection
机译:
脱渗透检测可穿戴医疗系统的开发
作者:
Jaromir Zak
;
Dmitry Solovei
;
Jiri Sedlacek
;
JaromirHubalek
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
sportsmen;
version;
detection;
21.
A Novel X-Ray Diffraction Technique for Analysis of Die Stress Inside Fully Encapsulated Packaged Chips
机译:
一种新型X射线衍射技术,用于分析全封装包装芯片内的模具应力
作者:
Chiu Soon WONG
;
Nick BENNETT
;
David ALLEN
;
Andreas DANILEWSKY
;
Patrick McNALLY
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
function;
expansion;
fabrication;
22.
Crossed Polymer Optical Waveguide for Optical Printed Circuit Board
机译:
用于光印刷电路板的交叉聚合物光波导
作者:
Keishiro Shitanda
;
Takaaki Ishigure
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
simulation;
propagation;
decrease;
23.
Towards Reel-to-Reel Integration of Ultra-Thin Chips to Polymer Foils
机译:
向聚合物箔的卷轴与卷轴整合到聚合物箔
作者:
Marcel Tichem
;
Maarten Cauwe
;
Zlatko Hajdarevic
;
Emine Eda Kuran
;
Benny Naveh
;
Ashok Sridhar
;
Philipp Weissel
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
redistribution;
interconnection;
precision;
24.
Die shear strength as a function of bond frame geometry - Au-Au thermo-compression bonding
机译:
模具剪切强度作为粘合框架几何形状的功能 - Au-Au热压缩粘合
作者:
Torleif André Tollefsen
;
Andreas Larsson
;
Maaike Margrete Visser Taklo
;
Erik Poppe
;
Kari Schj?lberg-Henriksen
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
simulations;
compression;
function;
25.
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
机译:
基于低成本塑料材料的芯片嵌入解决方案作为智能标签的启用技术
作者:
Maarten Cauwe
;
Bjorn Vandecasteele
;
Johan De Baets
;
Jeroen van den Brand
;
Roel Kusters
;
Ashok Sridhar
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
controller;
interconnection;
demonstrator;
26.
Embedded components in Photovia Substrates
机译:
Photovia基材中的嵌入式组件
作者:
J. Reboun
;
A. Hamá?ek
;
T. Blecha
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
inductors;
substrates;
deposition;
27.
Assembly tolerance requirements for photonics packaging of multi-cell laser power converters
机译:
多电池激光功率转换器的光子件包装的组装公差要求
作者:
R. Rieske
;
S. Sohr
;
K. Nieweglowski
;
K.-J. Wolter
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
process;
distribution;
discover;
28.
Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments
机译:
用于照明应用的PET箔上的裸芯片LED:热设计建模和粘接实验
作者:
D.A. van den Ende
;
R.H.L. Kusters
;
M. Cauwe
;
A. van der Waal
;
J. van den Brand
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
temperature;
comparison;
temperatures;
29.
Experimental and Modelling Study on the Effects of Refinishing Lead-Free Microelectronic Components
机译:
改进无铅微电子组分影响的实验和建模研究
作者:
Stoyan Stoyanov
;
Chris Best
;
Chunyan Yin
;
M. O. Alam
;
Chris Bailey
;
Peter Tollafield
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
solution;
components;
subsequent;
30.
Component Layout Influences on Solder Joint Reliability Studied Using Through Life Inspection Techniques
机译:
组件布局对使用寿命检测技术研究的焊接接头可靠性影响
作者:
Derek R. Braden
;
Ryan S. H. Yang
;
Janusz Duralek
;
Guang-Ming Zhang
;
David M. Harvey
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
interconnect;
duration;
location;
31.
The Impact of Material Composition and Process Parameters on the cSi Solar Cell Interconnection
机译:
材料组成和工艺参数对CSI太阳能电池互连的影响
作者:
Sebastian Schindler
;
Jens Schneider
;
Robert Klengel
;
Matthias Petzold
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
interconnection;
characterization;
electronics;
32.
Reliable HT electronic packaging - Optimization of a Au-Sn SLID joint
机译:
可靠的HT电子包装 - 优化AU-SN滑动接头
作者:
Torleif A. Tollefsen
;
Maaike M. Visser Taklo
;
Knut E. Aasmundtveit
;
Andreas Larsson
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
temperature;
optimization;
combination;
33.
Stencil technology for wafer level bumping
机译:
用于晶圆水平碰撞的模板技术
作者:
Robert W. Kay
;
Gerard Cummins
;
Marc P. Y. Desmulliez
;
Thomas Krebs
;
Richard Lathrop
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
consecutive;
consecutive;
resolution;
34.
Magnetic Force Driven Self-Assembly of Ultra-Thin Chips
机译:
磁力驱动超薄芯片的自组装
作者:
E. E. Kuran
;
M. Tichem
;
U. Staufer
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
precision;
promotes;
integration;
35.
Development of a Multi-Terminal Crimp Package for Smart Textile Integration
机译:
开发用于智能纺织集成的多终端压接包
作者:
Erik P. Simon
;
Christine Kallmayer
;
Martin Schneider-Ramelow
;
Klaus-Dieter Lang
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
Smart-textile;
crimp technology;
CFP - Crimp Flat Pack;
packaging;
PASTA;
36.
Low temperature joining technique (LTJT) as an alternative to lead-free soldering for die-attach applications
机译:
低温加入技术(LTJT)作为模具附着应用的无铅焊接的替代方案
作者:
Mateusz Jarosz
;
Malgorzata Jakubowska
;
Konrad Kielbasinski
;
Anna Mlozniak
;
Marian Teodorczyk
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
application;
distribution;
composition;
37.
Characterization of intermetallic compounds in Cu-Al ball bonds: thermo-mechanical properties, interface delamination and corrosion
机译:
Cu-Al球键中金属间化合物的表征:热机械性能,界面分层和腐蚀
作者:
G.H.M. Gubbels
;
M.H.M. Kouters
;
O. Dos Santos Ferreira
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
corrosion;
oxidation;
solution;
38.
Anisotropic Conductive Film Interconnects for Fine-pitch MEMS
机译:
各向异性导电膜互连用于细间距MEMS
作者:
Hoang-Vu Nguyen
;
Helge Kristiansen
;
Andreas Larsson
;
Erik Poppe
;
Rolf Johannessen
;
Nils Hoivik
;
Knut E. Aasmundtveit
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
results;
solution;
conductive;
39.
Inductively Excited Lock-in Thermography for PCB-Vias
机译:
用于PCB-VIA的电感激励锁定热成像
作者:
J. Bohm K. Meier
;
K.-J. Wolter
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
correlation;
excitation;
detection;
40.
Second-level interconnects reliability as a function of PCB build-up
机译:
第二级互连可靠性作为PCB积累的功能
作者:
W.C. Maia Filho
;
A. Grivon
;
J.G. Chesnay
;
M. Brizoux
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
conclusions;
construction;
components;
41.
Design and fabrication of a scalable high-reliability vacuum sealed package for infrared detectors
机译:
用于红外探测器可扩展的高可靠性真空密封封装的设计和制造
作者:
B. Fisette
;
C. Chevalier
;
A. Lépine
;
M.A. Boucher
;
C. Larouche
;
M. Tremblay
;
D. Lemieux
;
L.P. Tremblay
;
D. Dufour
;
Y. Desroches
;
P. Topart
;
F. Chateauneuf
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
measurements;
efficiency;
mission;
42.
In-plane pigtailing of Silicon Photonics Device using 'semi-passive' strategies
机译:
使用“半导体”策略在平面硅光态装置的平面钉子
作者:
Stéphane Bernabé
;
Henri Porte
;
Christophe Roux
;
Pascal Blind
;
Christophe Kopp
;
Gilles Lasfargues
;
Isabelle Borel
;
Paul Gindre
;
Laurence Gabette
;
Stéphane Nicolas
;
Jean-Marc Fédéli
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
configurations;
platforms;
emitters;
43.
Capillary Self-alignment Dynamics for R2R Manufacturing of Mesoscopic System-in-foil Devices
机译:
用于介绍系统内铝箔装置R2R制造的毛细管自对准动力学
作者:
Gari Arutinov
;
Andrés Vásquez Quintero
;
Edsger C. P. Smits
;
Bart van Remoortere
;
Jeroen van den Brand
;
Herman F. M. Schoo
;
Danick Briand
;
Nico F. de Rooij
;
Andreas Dietzel
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
misalignment;
interconnection;
precision;
44.
New Flipchip Technology
机译:
新的Flipchip技术
作者:
Reinhard Windemuth PFSE Europe
;
Takatoshi Ishikawa PFSC Japan
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
PI. Flipchip;
Embedded Technology Miniturization;
METAL JOINT;
CONTACTING;
P2. machine parameters;
ESC process design;
Process flow;
Process amp;
Quality criteria P3. cross sections;
GGI ultrasonic flipchip;
Process conditions;
Material parameters;
machine parameters;
process window P4. Status of Industry;
organic substrates (Flex and FR4);
heated bonding tool;
substrate temperature P5. Embedding components into Organic subtrates;
high yield;
shielding characteristics;
SIMPACT;
Laser Cavity;
Conclusion;
45.
Investigation of FactorsThat I nfluenoe Creep Corrosion - iNEM I Project Report
机译:
影响蠕变腐蚀的因素调查 - INEM I项目报告
作者:
Grace OMalley
;
Haley Fu
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
experiments;
corrosion;
electronics;
46.
Thermal behavior of stack-based 3D ICs
机译:
基于堆栈的3D IC的热行为
作者:
Papa Momar SOUARE
;
Fran?ois de CRECY
;
Vincent FIORI
;
Haykel BEN JAMAA
;
Alexis FARCY
;
Sebastien GALLOIS-GARREIGNOT
;
Andras BORBELY
;
Sandrine LHOSTIS
;
Patrick LEDUC
;
Severine CHERAMY
;
Clément TA VERNIER
;
Jean MICHAILOS
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
integration;
miniaturization;
performance;
47.
Robust Process Windows for Laser Induced Forward Transfer of Thin Film Metal to Create I nter connects
机译:
用于激光诱导薄膜金属的强大工艺窗口以创建I nter连接
作者:
G. Oosterhuis
;
M.P. Giesbers
;
P.A.J. van Melick
;
M.B. Hoppenbrouwers
;
A. M Prenen
;
A.J. Huis int Veld
;
G. Knippels
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
contamination;
deposition;
integration;
48.
Investigating Capacitor Lifetimes under Thermal Stress
机译:
在热应力下调查电容器寿命
作者:
Jánó Rajmond
;
Pitic? Dan
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
conditions;
recommendations;
behavior;
49.
Finite Element Analysis of a High Voltage Semiconductor Polymeric Package Design using a Taguchi Based Experimental Design
机译:
基于Taguchi的实验设计的高压半导体聚合物包装设计的有限元分析
作者:
N. S. Nobeen
;
D. C. Whalley
;
D. A. Hutt
;
B. Haworth
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
convolutes;
interactions;
distribution;
50.
Experimental Characterization and Finite Element Analysis of Thermo-Mechanical Stress in Flip-Chip-and Wirebond-Assemblies on Flexible and lnjection Molded Thermoplastic Substrates
机译:
柔性镀膜型热塑性基板上倒装芯片和线桥组件热机械应力的实验表征及有限元分析
作者:
Goth C.
;
Reinhardt A.
;
Franke J.
;
Schober M.
;
Kück H.
;
Majcherek S.
;
Brose A.
;
Schmidt B.
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
resistors;
conditions;
characterization;
51.
Low Cost Environmentally Friendly Ultrasonic Embossed Electronic Circuit Board
机译:
低成本环保超声波压花电子电路板
作者:
Paul Gielen
;
Rob Sillen
;
Erik Puik
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
microproducts;
functions;
production;
52.
Effects of Bonding Pressure on Quality of SLID Interconnects
机译:
粘接压力对杆状互连质量的影响
作者:
Iuliana Panchenko
;
Juergen Grafe
;
Maik Mueller
;
Klaus-Juergen Wolter
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
fraction;
compounds;
electron;
53.
Characterization of hermetic wafer-level Cu-Sn SLID bonding
机译:
密封晶片级Cu-Sn滑动键合的特征
作者:
H.J. van de Wiel
;
A-S. B. Vard?y
;
G. Hayes
;
H.R. Fischer
;
A. Lapadatu
;
M.M.V. Taklo
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
microscopy;
crystallites;
diffusion;
54.
High density 3D Silicon Interposer technology development and electrical characterization for high end applications
机译:
高密度3D硅插入技术开发和高端应用的电气特性
作者:
Jean Charbonnier
;
Myriam Assous
;
Jean-Philippe Bally
;
Ken Miyairi
;
Masahiro Sunohara
;
Robert Cuchet
;
Helene Feldis
;
Nicole Bouzaida
;
Nathalie Bernard-Henriques
;
RachidHida
;
Thierry Mourier
;
Gilles Simon
;
Mitsutoshi Higashi
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
Silicon Interposer;
TSV;
3D Integration;
DC test;
Assembly.;
55.
Modal analysis of board vibration during mechanical reliability tests of lead-free solder joints
机译:
无铅焊点机械可靠性试验期间板振动模态分析
作者:
P. Matkowski
;
I Brabandt
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
conclusions;
resistors;
standardization;
56.
Directed Self-Assembly of Nanoparticles for Novel Electrical Interconnects
机译:
用于新型电互连的纳米粒子的定向自组装
作者:
Yu Liu
;
Gerd Schlottig
;
Heiko Wolf
;
Georgios A. Sotiriou
;
Thomas Brunschwiler
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
evolution;
characterization;
temperatures;
57.
Potential interconnect technologies for high power LEDs assemblies
机译:
高功率LED组件的潜在互连技术
作者:
X. J. Zhao
;
J.F.J.M.Caers
;
Sander Noijen
;
Ying Zhong
;
M. de Jong
;
Harry Gijsbers
;
Gorden Elger
;
Harald Willwohl
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
temperature;
resistance;
applications;
58.
FAN-OUT WLP-THE ENABLER FOR SYSTEM-I N-PACKAGE ON WAFER LEVEL (WLSIP)
机译:
FAN-OUT WLP-SYSTEM-I N包装的启动器晶圆级(WLSIP)
作者:
Steffen Kr?hnert
;
José Campos
;
Eoin OToole
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
Fan-Out Wafer Level Packaging;
FOWLP;
WLP;
eWLB;
MCM;
MCP;
SiP;
WLSiP;
1L-RDL: 2L-RDL;
solder ball pitch;
stacking.;
59.
Reliability Assessment of MEMS Devices - A Case Study of a 3 axis Gyroscope
机译:
MEMS器件的可靠性评估 - 一种3轴陀螺仪的案例研究
作者:
Joonas Makkonen
;
Mikael Broas
;
Jue Li
;
Jussi Hokka
;
Toni T. Mattila
;
Mervi Paulasto-Kr?ckel
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
collisions;
failures;
orientation;
60.
Underfill material Screening and Process Characterization for 3D Stacking
机译:
3D堆叠的底部填充材料筛选和过程表征
作者:
K.J. Rebibis
;
A. LaManna
;
C. Gerets
;
T. Wang
;
R. Daily
;
G. Capuz
;
Andy Miller
;
E. Beyne
;
B.Swinnen
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
vendors;
solution;
selection;
61.
Thermal Analysisof High Power LED Subassembliesfor Automotive Front Light Application
机译:
高功率LED子组件的热分析汽车前光应用
作者:
Gordon Elger
;
Harald Willwohl
;
Josef Schug
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
condition;
solutions;
combination;
62.
Dynamic Three Dimensional Simulation of Wire Bonding Processes on soft Polymeric Substrates for High Frequency Applications
机译:
高频应用软聚合基材的电线键合工艺动态三维模拟
作者:
F. Kraemer
;
P. Ritter
;
M. Moller
;
S. Wiese
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
formation;
penetrations;
metallization;
63.
Synergy between 2.5/3D Development and Hybrid 3D Wafer Level Fanout
机译:
2.5 / 3D开发和混合3D晶圆扇区之间的协同作用
作者:
John Hunt
;
YC Ding
;
Adren Hsieh
;
Jason Chen
;
Dinos Huang
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
Silicon;
integration;
Redistribution;
64.
Reliability Investigation of SMT-Boards for the Automotive Industry
机译:
汽车工业SMT板的可靠性调查
作者:
H. Wohlrabe
;
J. Trodler
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
automotive;
conditions;
challenge;
65.
Miniaturization - Solder Paste Attributes for Maximizing the Print Reflow Manufacturing Process Window
机译:
小型化 - 用于最大化印刷和回流制造过程窗口的焊膏属性
作者:
Karthik Vijay
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
deviation;
conditions;
miniaturization;
66.
Manufacturing of Miniaturised Microsystems for Low Power Wireless Body-Area-Networks(BAN) Medical Applications-Technological Challenges and Achievements
机译:
低功耗无线体积网络(禁令)医疗应用的小型微型系统制造 - 技术挑战和成就
作者:
D. Manessis
;
A. Podlasly
;
A. Ostmann
;
R. Aschenbrenner
;
K-D. Lang
会议名称:
《Electronics System-Integration Technology Conference》
|
2012年
关键词:
substrate;
heterogeneous;
technologies;
67.
Void formation in Cu-Sn SLID bonding for MEMS
机译:
在Cu-Sn滑动键合的空隙形成MEMS
作者:
Ross G.
;
Hongbo Xu
;
Vuorinen V.
;
Paulasto-Krockel M.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
bonding processes;
chemical interdiffusion;
copper;
electroplating;
encapsulation;
hermetic seals;
mechanical stability;
micromechanical devices;
reliability;
tin;
voids (solid);
Cu-Sn;
EP copper;
IMC;
KV formation;
Kirkendall void formation;
MEMS system;
SLID bonding;
atom flux;
electroplated copper;
encapsulation method;
hermetic sealing;
intermetallic compound;
mechanical stability;
microelectronicmechanical system;
reliability;
solid-liquid interdiffusion bonding;
voiding propensity;
Additives;
Aging;
Bonding;
Copper;
Current density;
Reliability;
Soldering;
68.
Fully roll-to-roll gravure printed carbon nanotube based flexible thin film transistor backplane on 100 m of poly(ethyleneterephtalate) (PET) web
机译:
完全滚动凹版印刷印刷碳纳米管基柔性薄膜晶体管底板100米聚(乙基苯甲酸乙酸酯)(PET)网
作者:
Wookyu Lee
;
Hyunmo Koo
;
Junfeng Sun
;
Yunchang Choi
;
Gyoujin Cho
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
barium compounds;
carbon nanotube field effect transistors;
conducting materials;
dielectric materials;
electric properties;
flexible electronics;
nanoparticles;
semiconductor device reliability;
thin film transistors;
BaTiOlt;
subgt;
3lt;
/subgt;
PET;
R2R gravure;
dielectric ink;
electrical properties;
flexible thin film transistor backplane;
fully printed TFT backplanes;
fully roll-to-roll gravure printed carbon nanotube;
on-off current ratio;
overlay printing registration accuracy;
poly(ethyleneterephtalate) web;
printing reliability;
printing units;
rheological properties;
scalability factors;
sensor sheets;
silver nanoparticle based conductive ink;
single walled carbon nanotube based semiconducting ink;
threshold voltage;
transconductance;
wall paper manufacturing;
Backplanes;
Cameras;
Ink;
Positron emission tomography;
Printing;
Scalability;
Thin film transistors;
69.
Porous silicon electrodes for high performance integrated supercapacitors
机译:
用于高性能集成超级电容器的多孔硅电极
作者:
Grigoras K.
;
Keskinen J.
;
Ahopelto J.
;
Prunnila M.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
III-V semiconductors;
atomic layer deposition;
coating techniques;
elemental semiconductors;
silicon;
supercapacitors;
ALD;
Si;
TiN;
atomic layer deposition;
charge cycles;
discharge cycles;
double layer capacitor characteristic;
energy density;
high aspect ratio pores;
integrated micro supercapacitors;
porous electrodes;
porous matrix;
power density;
ultra-thin coating;
Coatings;
Electrodes;
Silicon;
Supercapacitors;
Tin;
70.
Si dry etching for TSV formation and backside reveal
机译:
Si干蚀刻TSV形成和背面透露
作者:
Wang Z.
;
Jiang F.
;
Zhang W.Q.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
carbon compounds;
elemental semiconductors;
integrated circuit packaging;
silicon;
sputter etching;
sulphur compounds;
three-dimensional integrated circuits;
3D IC packaging;
Bosch process;
Clt;
subgt;
4lt;
/subgt;
Flt;
subgt;
8lt;
/subgt;
DRIE process;
SFlt;
subgt;
6lt;
/subgt;
Si;
TTV;
data bandwidth;
deep reactive ion etching technology;
dry etch process;
front-side wafer processing;
high-aspect ratio;
ion trajectories;
isotropic etching;
non-Bosch process;
reveal process;
sequential cycles;
through silicon via technology;
total thickness variation;
via-middle TSV integration;
wall passivation;
wall scalloping;
Dry etching;
Ions;
Process control;
Silicon;
Sulfur hexafluoride;
Through-silicon vias;
71.
Spray coating of self-aligning passivation layer for metal grid lines
机译:
金属栅极线自对准钝化层喷涂
作者:
Vuorinen T.
;
Janka M.
;
Rubingh J.E.
;
Tuukkanen S.
;
Groen P.
;
Lupo D.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
leakage currents;
organic light emitting diodes;
passivation;
photovoltaic cells;
spray coating techniques;
Joule heating;
OLED;
film thickness;
leakage current;
metal grid lines;
organic light emitting diodes;
photovoltaic cells;
self-aligning passivation layer;
spray coating;
Coatings;
Dielectrics;
Insulators;
Silver;
Substrates;
Surface treatment;
72.
Prediction of mechanical properties on zinc system alloys and their application to high temperature lead-free solder
机译:
预测锌系统合金对高温无铅焊料的机械性能及其应用
作者:
Zhefeng Xu
;
Matsugi K.
;
Yongbum Choi
;
Terada K.
;
Suetsugu K.-I.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
aluminium alloys;
elongation;
solders;
tensile strength;
tin alloys;
zinc alloys;
Zn-Al-Sn;
electronic parameter;
elongation;
high temperature lead-free solder;
mechanical property prediction;
power semiconductor devices packages;
pressure 195 MPa to 225 MPa;
s-orbital energy level;
system multicomponent alloys;
temperature 645 K to 973 K;
ultimate tensile strength;
zinc system alloys;
Lead;
Solids;
Temperature;
Temperature measurement;
Tin;
Zinc;
73.
A cost effective method for TSV backside reveal
机译:
TSV背面揭示的成本有效方法
作者:
Wang L.
;
Li H.
;
Song C.
;
Zhang W.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
etching;
three-dimensional integrated circuits;
wetting;
TSV back etch;
TSV backside reveal unit process;
TSV integration technology;
cost effective method;
interconnect bandwidth;
mechanical grind;
process control;
reveal etching process;
through silicon via;
vertical signal path;
via-first TSV integration flow;
via-mid TSV integration flow;
wafer back side process module;
wet etching process;
wire delay reduction;
Etching;
Process control;
Silicon;
Surface topography;
Through-silicon vias;
74.
High speed through glass via manufacturing technology for interposer
机译:
通过制造技术用于插入器的高速通过玻璃
作者:
Ostholt R.
;
Ambrosius N.
;
Kruger R.A.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
drilling;
glass;
integrated circuit manufacture;
laser beam etching;
metallisation;
three-dimensional integrated circuits;
Si;
TGV manufacturing process;
anisotropic etching;
base machine;
chemical resistance;
glass additive;
glass drilling technology;
glass interposers;
high density substrate material;
high speed through glass via manufacturing technology;
interposer materials;
laser induced chemical etching;
laser induced glass etching technology;
low loss;
mechanical strength;
metallization;
on the fly process;
organic materials;
silicon materials;
size 10 mum to 200 mum;
thermal treatments;
ultrashort laser pulses;
Chemical lasers;
Etching;
Glass;
Laser ablation;
Substrates;
75.
Effect of UV light and low temperature on solution-processed, high-performance metal-oxide semiconductors and TFTs
机译:
UV光和低温对溶液加工,高性能金属氧化物半导体和TFT的影响
作者:
Majumdar H.
;
Leppaniemi J.
;
Ojanpera K.
;
Huttunen O.-H.
;
Alastalo A.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
annealing;
curing;
thin film transistors;
ultraviolet radiation effects;
UV exposure;
UV light;
electrical properties;
flexible plastic substrates;
high-performance metal-oxide semiconductors;
low temperature effect;
low-temperature thermal annealing;
printable transistors;
solution-processed metal-oxide semiconductors;
thin film transistors;
ultra-violet curing;
Annealing;
Films;
Metals;
Plastics;
Substrates;
Thin film transistors;
76.
Printed low-voltage programmable write-once-read-many-memories
机译:
印刷低压可编程写入次读取多记忆
作者:
Leppaniemi J.
;
Fukuda N.
;
Alastalo A.
;
Mattila T.
;
Eiroma K.
;
Kololuoma T.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
PROM;
conductors (electric);
electric fuses;
nanoparticles;
sintering;
write-once storage;
antifuse operation;
electrical sintering;
fuse-type WORM memory;
low-bit count low-complexity printed electronic system;
nanoparticle;
printed battery;
printed conductor;
printed low-voltage programmable write-once-read-many-memory;
reverse offset printing fabrication;
Conductors;
Grippers;
Ink;
Nanoparticles;
Printing;
Substrates;
Writing;
77.
Drawbacks of the nanoparticle reinforced lead-free BGA solder joints
机译:
纳米粒子增强无铅BGA焊点的缺点
作者:
Huayu Sun
;
Chan Y.C.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
ball grid arrays;
bismuth alloys;
nanoparticles;
silver alloys;
solders;
tin alloys;
CNTs-doped solder paste;
IMCs;
SnBiAg;
aging;
ball shear test;
mechanical properties;
mechanical stirring;
nanoparticle reinforced lead-free BGA solder joints;
nanoparticle reinforced solder joint phenomenon degradation;
quantitative experiment loss;
redistribution phenomenon detection;
solder ball;
solder flux outward flow;
time 100 h;
Aging;
Degradation;
Lead;
Mechanical factors;
Nanoparticles;
Soldering;
78.
Integrated printed hybrid electronics on paper
机译:
纸上集成印刷的混合电子产品
作者:
Sandberg H.G.O.
;
Gaspar C.
;
Hakola L.
;
Rentrop C.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
coating techniques;
modules;
paper technology;
printed circuits;
surface mount technology;
ROPAS project;
SMD component;
additive printing;
basic electronic function;
coating technique;
electronic antitampering indicator;
electronic module;
functional electronic circuit hybrid manufacturing method;
integrated printed hybrid electronics;
material cost;
paper;
reel to reel production;
traditional converting technology;
Batteries;
Ink;
Light emitting diodes;
Printing;
Resistors;
Security;
Substrates;
79.
Thermal management: A key point for the integration in solid state lighting systems
机译:
热管理:固态照明系统集成的关键点
作者:
Gasse A.
;
Corfa A.
;
Bernabe S.
;
Aitmani N.
;
Lhermet N.
;
Henry D.
;
Alibert P.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
LED lamps;
finite element analysis;
infrared imaging;
thermal analysis;
thermal management (packaging);
thermal resistance;
transient analysis;
ANSYS;
LED dies;
LED light engines;
LED light flux;
LED-based systems;
board types;
chip on board technology;
discrete thermal resistances;
heat transfer mechanisms;
infrared thermography;
junction temperature;
numerical finite elements modelling;
package configurations;
solid state lighting systems;
thermal management;
transient thermal analysis;
Electrical resistance measurement;
Light emitting diodes;
Materials;
Temperature measurement;
Thermal conductivity;
Thermal resistance;
80.
Investigations on advanced soldering mechanisms for transient liquid phase soldering (TLPS) in power electronics
机译:
电力电子技术瞬态液相焊接(TLPS)先进焊机机理的研究
作者:
Syed-Khaja A.
;
Franke J.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
copper alloys;
reflow soldering;
tin alloys;
voids (solid);
Cult;
subgt;
3lt;
/subgt;
Sn;
Cult;
subgt;
6lt;
/subgt;
Snlt;
subgt;
5lt;
/subgt;
interconnections;
intermetallic phase formation;
over-pressure convection soldering;
power electronics;
reflow soldering mechanisms;
size 15 mum to 20 mum;
transient liquid phase soldering;
vacuum vapor-phase soldering;
Joints;
Power electronics;
Soldering;
Standards;
Substrates;
Temperature;
TLPS;
die-attach;
over-pressure convection soldering;
thin solder layers;
vacuum vapor-phase soldering;
81.
Cu pillar FC ecosystem — Technologies for the masses
机译:
Cu Pillar FC生态系统 - 群众的技术
作者:
Marwan Wang
;
Chienfan Chen
;
Chang J.
;
Cheung C.
;
Chen W.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
ball grid arrays;
copper alloys;
flip-chip devices;
integrated circuit interconnections;
BGA technology;
Cu;
flip chip copper pillar CSP;
high volume manufacturing technology;
packaging industry ecosystem;
Chip scale packaging;
Ecosystems;
Flip-chip devices;
Industries;
Packaging;
Substrates;
Technological innovation;
82.
Strategies for glass based photonic system integration
机译:
基于玻璃光子系统集成的策略
作者:
Schroder H.
;
Brusberg L.
;
Bottger G.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
integrated optics;
micro-optics;
optical glass;
optical interconnections;
packaging;
beam-splitting components;
board level packaging;
glass based photonic system integration;
interposer;
isolators;
laser diodes;
micro lenses;
micro-optical components;
modulators;
optical fibers;
optical interconnection;
opto-electronic components;
photonic packaging;
thin glass;
Glass;
Integrated optics;
Optical fibers;
Optical films;
Optical interconnections;
83.
Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization — Difficulties and solution
机译:
微电子工业粘合剂表征DMA和裂缝实验中的界面裂缝韧性表征 - 困难与溶液
作者:
Maus I.
;
Preu H.
;
Niessner M.
;
Nabi H.
;
Jansen K.M.B.
;
Pantou R.
;
Weiss L.
;
Michel B.
;
Wunderle B.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
conductive adhesives;
failure analysis;
fracture mechanics;
fracture toughness;
integrated circuit reliability;
relaxation;
semiconductor technology;
μMMT;
DMA;
ICA;
cohesive zone modeling;
critical energy release rate;
critical interface fracture data;
dynamic mechanical analysis;
electrically conductive adhesive;
epoxy based die attach material;
failure modeling;
interfacial fracture toughness characterization;
isotropic conductive adhesive;
lifetime prediction;
material characterization;
measurement method;
microelectronic industry;
micromixed mode tester;
relaxation experiment;
semiconductor technology;
viscoelastic material model;
Analytical models;
Force;
Frequency measurement;
Materials;
Polynomials;
Strain;
Temperature measurement;
84.
Local residual stresses in tungsten coated TSVs characterized by synchrotron X-ray nanodiffraction and Raman spectroscopy
机译:
钨涂层TSV的局部残留应力,其特征是同步X射线纳米二聚 - 重和拉曼光谱的特征
作者:
Defregger S.
;
Steffenelli M.
;
Deluca M.
;
Maier G.
;
Sartory B.
;
Burghammer M.
;
Kraft J.
;
Carniello S.
;
Keckes J.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
Raman spectroscopy;
elemental semiconductors;
integrated circuit interconnections;
integrated circuit metallisation;
silicon;
synchrotrons;
thermal expansion;
thermal stresses;
thin film devices;
three-dimensional integrated circuits;
tungsten;
Raman spectroscopy;
Si;
TSV metallization;
W;
degradation effects;
local residual stresses;
mechanical constrains;
ripple-like morphology;
spatial resolution;
stress magnitude oscillations;
stress state;
synchrotron X-ray nanodiffraction;
tensile residual stresses;
thermal constrains;
thermal expansion;
thin film;
three-dimensional integration possess;
through silicon vias;
via wall;
wafer interconnection;
Residual stresses;
Silicon;
Synchrotrons;
Tungsten;
X-ray diffraction;
85.
Photoelectrical and microphysical properties of Sol-Gel derived IGZO thin films for printed TFTs
机译:
溶胶 - 凝胶衍生的IGZO薄膜用于印刷TFT的光电和微神科性质
作者:
Matsuo T.
;
Sugahara T.
;
Hirose Y.
;
Jiu J.
;
Nagao S.
;
Suganuma K.
;
Jianying He
;
Zhiliang Zhang
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
electrical conductivity;
sol-gel processing;
thin film transistors;
vacuum deposition;
TCO semiconductor layer films;
electrical conductivity;
microphysical properties;
optical transmittance;
photoelectrical properties;
printed TFT;
sol-gel method;
solution-based methods;
stack layer transparent conductive IGZO thin films;
thin-film transistors;
transparent conducting oxides;
ultra-high vacuum deposition;
Chemicals;
Coatings;
Conductivity;
Films;
Substrates;
Thin film transistors;
Zinc oxide;
86.
Reliability of carbon nanotube bumps for chip on glass application
机译:
玻璃应用芯片碳纳米管凸块的可靠性
作者:
Xiaogang Fan
;
Xiaolei Li
;
Wei Mu
;
Di Jiang
;
Shirong Huang
;
Yifeng Fu
;
Yan Zhang
;
Johan Liu
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
adhesive bonding;
carbon nanotubes;
contact resistance;
glass;
integrated circuit interconnections;
reliability;
C-Si;
SiOlt;
subgt;
2lt;
/subgt;
anisotropic conductive adhesive;
carbon nanotube bumps;
chip on glass application;
contact resistance;
damp heat tests;
glass substrate;
interconnection;
paper-mediated controlled method;
pressure 127.4 MPa;
reliability;
silicon chip;
temperature 170 degC;
thermal cycling;
time 8 s;
Carbon nanotubes;
Contact resistance;
Glass;
Reliability;
Resistance heating;
Substrates;
87.
Electronics packaging technologies for the volume integration in components for medical tools and instruments
机译:
电子包装技术,用于医疗工具和仪器组件中的批量集成
作者:
Detert M.
;
Schmidt B.
;
Wittig F.
;
Wagner D.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
biomedical electronics;
electronics packaging;
electronics packaging technologies;
form factor;
functional catheter tip;
influence factors;
interdisciplinary approach;
medical instruments;
medical product;
medical tools;
microsystems technology;
miniaturized catheter tip;
volume integration;
Catheters;
Cavity resonators;
Instruments;
Materials;
Medical diagnostic imaging;
Reliability;
Shape;
88.
Methodology based on experiments and 3-D EM simulations for frequency characterization of buried capacitors
机译:
基于实验和3-D EM模拟的方法,用于埋入电容器的频率特性
作者:
Wade M.
;
Bord-Majek I.
;
Dubois T.
;
Duchamp G.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
capacitors;
permittivity;
3D EM simulation;
3D electromagnetic simulation;
dielectric permittivity;
electronic circuit;
embedded buried capacitor technology;
frequency characterization;
parallel configuration;
parasitic inductance reduction;
size reduction;
Capacitors;
Frequency measurement;
Permittivity;
Permittivity measurement;
Resonant frequency;
89.
Investigations regarding variations of material properties and their impact on lifetime prediction for Cu-vias in circuit boards
机译:
关于材料特性变化及其对电路板CU-VIA寿命预测的影响的研究
作者:
Abali B.E.
;
Lofink P.
;
Muller W.H.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
copper;
fatigue cracks;
finite element analysis;
materials properties;
plasticity;
printed circuits;
vias;
Cu;
circuit board failure;
copper-vias;
cracking;
fatigue;
finite element method;
irreversible behavior;
lifetime prediction;
material property variation;
plastic energy dissipation;
thermal loading;
Copper;
Fatigue;
Integrated circuit modeling;
Loading;
Plastics;
Strain;
90.
GaN/SiC MMICs and packaging for use in future transmit / receive modules
机译:
GaN / SIC MMIC和包装用于将来的传输/接收模块使用
作者:
Oppermann M.
;
Thurow F.
;
Bunz B.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
MMIC;
ceramic packaging;
electronics packaging;
gallium compounds;
modules;
printed circuits;
silicon compounds;
surface mount technology;
transceivers;
GaN;
L/HTCC technology;
MMIC;
PCB;
QFN;
RF interface;
SMD based electronic product;
SiC;
T/R module design;
ceramic package;
gallium nitride;
low/high temperature cofired ceramic;
monolithic microwave integrated circuit;
multifunctional sensor;
packaging technology;
power device;
printed circuit board;
quad flat no-lead;
transmit/receive module;
Gallium nitride;
MMICs;
Ports (Computers);
Radar antennas;
Radio frequency;
Spaceborne radar;
91.
Comparison between ENA and ENEPIG surface finish for high density TBGA package
机译:
高密度TBGA封装ENA和ENEPIG表面光洁度的比较
作者:
Pun K.
;
Islam M.N.
;
Tin Wing Ng
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
ball grid arrays;
brittle fracture;
copper alloys;
ductile fracture;
gold alloys;
lead bonding;
nickel alloys;
palladium alloys;
reflow soldering;
shear strength;
solders;
surface finishing;
Cu-Ni-Pd-Au;
ENA surface finish;
ENEPIG surface finish;
ball shear testing;
brittle fracture;
columnar IMCs;
ductile fracture;
electroless nickel-electroless palladium-immersion gold;
electronic products;
extended reflow soldering;
high density TBGA package;
long-term reliability;
shear strengths;
solder joint quality;
solder system;
temperature 245 degC;
wire bondability;
Gold;
Nickel;
Reliability;
Soldering;
Surface cracks;
Surface finishing;
92.
Thermal stability of electroless nickel/immersion gold surface finish for direct bond copper
机译:
无电镀镍/浸渍金表面光洁度的热稳定性直接粘接铜
作者:
Min-Su Kim
;
Nishikawa H.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
copper;
crystallisation;
electroless deposited coatings;
electroplating;
gold;
nickel;
phase transformations;
substrates;
surface finishing;
thermal stability;
Cu;
DBC substrate;
ENIG plating;
air condition;
crystallization;
direct bond copper;
electroless nickel/immersion gold surface finish;
nanocrystalline nickel;
phase transformation;
phosphorus;
temperature 250 C;
thermal stability;
thermal storage test;
Aging;
Crystallization;
Gold;
Nickel;
Surface finishing;
Surface morphology;
Thermal stability;
93.
Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding
机译:
电沉积下纳米多孔结构控制和低温粘合的造成造影条件
作者:
Saito M.
;
Matsunaga K.
;
Mizuno J.
;
Nishikawa H.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
alloying;
annealing;
bonding processes;
dissolving;
electrodeposition;
gold alloys;
low-temperature techniques;
mass spectra;
nanoporous materials;
silver alloys;
thin films;
Au-Ag;
ICP-MS analysis;
anodic current;
as-deposited samples;
bond strength;
dealloying conditions;
electrochemical deposition;
electrode surfaces;
electrodeposited films;
inductively coupled plasma mass spectrometry;
low-temperature bond formation process;
nanoporous structure control;
selective dissolution;
size 10 nm to 20 nm;
small ligament size;
temperature 150 degC;
temperature 50 degC;
Annealing;
Electric potential;
Films;
Gold;
Ligaments;
Nanostructures;
94.
Influence of curing conditions on mechanical properties and reliability of the interconnects made by ICA for printed electronics with micro additives
机译:
用微量添加剂对印刷电子产品进行互连机械性能和可靠性的影响
作者:
Koscielski M.
;
Sitek J.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
adhesives;
curing;
flexible electronics;
integrated circuit interconnections;
integrated circuit reliability;
ICA;
conductive adhesives;
curing conditions;
flexible substrate;
interconnects;
mechanical properties;
microadditives;
printed electronics;
reliability;
Conductive adhesives;
Consumer electronics;
Curing;
Radiofrequency identification;
Silver;
Substrates;
95.
Study on influence of silicone encapsulant for ceramic LED package after HTOL test
机译:
HTOL试验后陶瓷LED封装有机硅密封剂对陶瓷LED封装的影响研究
作者:
Jemin Kim
;
Byungjin Ma
;
Kwanhun Lee
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
Raman spectra;
adhesive bonding;
ceramic packaging;
encapsulation;
light emitting diodes;
phosphors;
silicones;
spectrophotometers;
spectrophotometry;
thermal stresses;
HTOL testing;
Raman analysis;
UV-VIS spectrophotometer;
bonding adhesive;
ceramic LED packaging;
high temperature operational life testing;
integrating sphere;
luminous flux measurement;
optical stress testing;
phosphor;
silicone encapsulant;
silicone samples transmittance;
test jig design;
thermal stress testing;
time 250 hour;
wavelength 300 nm to 400 nm;
Bonding;
Ceramics;
Electronic packaging thermal management;
Light emitting diodes;
Optical refraction;
Stress;
Thermal stresses;
96.
Relationship between bonding conditions and strength for joints using a Au nanoporous sheet
机译:
使用Au纳米孔板粘接条件与强度的关系
作者:
Matsunaga K.
;
Kim M.-S.
;
Nishikawa H.
;
Saito M.
;
Mizuno J.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
bonding processes;
gold;
nanoporous materials;
shear strength;
silver;
NPB;
bonding condition;
electronics industry;
gold nanoporous sheet;
gold-silver binary alloy;
high-temperature bonding process;
high-temperature electronic applications;
high-temperature lead-free solders;
interconnection technology;
lead-free interconnection material;
nanoporous bonding;
nanoporous sheet;
nitric acid;
no-solvent no-flux solid-state bonding technique;
selective element dissolution;
shear strength;
temperature 350 degC;
Bonding;
Gold;
Joints;
Ligaments;
Nitrogen;
Substrates;
97.
Packaging of thin film thermoelectric generators for autonomous sensor nodes
机译:
自主传感器节点薄膜热电发电机的包装
作者:
Zoller T.
;
Ehrenpfordt R.
;
Gavrikov A.
;
Nurnus J.
;
Kuck H.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
bending;
electronics packaging;
energy harvesting;
sensors;
thermoelectric conversion;
thin film devices;
Internet of Things;
IoT;
TEG packaging;
assembly;
autonomous sensor nodes;
coefficient-of-thermal expansion mismatch;
electrical shutdown;
energy harvesting application;
four-line bending test;
internal electrical resistance;
mechanical shutdown;
mechanical stability;
mechanical stress;
mechanical tests;
packaging process;
shear force stability;
shear force test apparatus;
standard molded LGA sensor package;
standard molded land grid array sensor package;
stress decoupling thermal adhesives;
thin-film thermoelectric generator packaging;
typical warpage;
Conductivity;
Electrical resistance measurement;
Force;
Generators;
Standards;
Thermal conductivity;
Thermal stability;
98.
Challenges for thermal management and production technologies in concentrating photovoltaic (CPV) modules
机译:
浓缩光伏(CPV)模块的热管理和生产技术的挑战
作者:
Wiesenfarth M.
;
Gamisch S.
;
Dorsam T.
;
Bett A.W.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
solar cells;
thermal management (packaging);
bypass diodes integration;
concentrating photovoltaics solar radiation;
cooled system;
electronic industry;
high heat flux;
photovoltaic modules;
solar cell architectures;
thermal management;
vacuum soldering;
wire bonding;
Lenses;
Photovoltaic cells;
Photovoltaic systems;
Receivers;
Solar radiation;
99.
Compression molding solutions for wafer level, large panel substrate, and advanced packaging
机译:
用于晶片级,大面板基板和先进包装的压缩成型解决方案
作者:
Claassen H.
;
Molenaar B.V.P.
;
Miura M.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
ball grid arrays;
compression moulding;
wafer level packaging;
BGA type substrates;
LED;
QFN;
advanced semiconductor packages;
compression molding technology;
large panel substrate packaging;
leadframes;
mass production;
regular MAP packages;
substrate molding;
wafer level molding;
wafer level packaging;
Compounds;
Compression molding;
Films;
Presses;
Substrates;
Transfer molding;
Wires;
100.
Development of TLP joining technique for fabrication of vertical interconnections in TSV stacking
机译:
TLP加入技术在TSV堆叠中垂直互连制造技术
作者:
Denteneer R.P.J.
;
Krassenburg L.C.P.
;
Brom J.H.G.
;
Biglari M.H.
会议名称:
《Electronics System-Integration Technology Conference》
|
2014年
关键词:
copper alloys;
electrodeposition;
integrated circuit bonding;
integrated circuit interconnections;
integrated circuit metallisation;
integrated circuit packaging;
nickel alloys;
soldering;
three-dimensional integrated circuits;
tin alloys;
Cu-Ni-Sn;
TLP joining technique;
TSV stacking;
die-attach operations;
direct Cu/Cu bonding;
electrochemical deposition;
elevated temperatures;
environmentally friendly metallic interconnection systems;
high-lead soldering;
high-temperature soldering;
metallization constituents;
metallization materials;
packaging technology;
reaction phenomena;
through silicon vias technology;
transient liquid-phase bonding;
vertical interconnection fabrication;
Annealing;
Bonding;
Intermetallic;
Nickel;
Through-silicon vias;
Tin;
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