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IEEE transactions on electronics packaging manufacturing

中文名称：IEEE关于电子封装制造的交易

ISSN：1521-334X
出版周期：Quarterly

发文量：283

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1.Automated Solder Inspection Technique for BGA-Mounted Substrates by Means of Oblique Computed Tomography

机译：Automated Solder Inspection Technique for BGA-Mounted Substrates by Means of Oblique Computed Tomography
- 作者：Teramoto A.;Murakoshi T.;Tsuzaka M.Fujita H.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第4期
2.Real-Time Quality Evaluation of Wire Bonding Using Input Impedance

机译：Real-Time Quality Evaluation of Wire Bonding Using Input Impedance
- 作者：Ling S.-F.;Zhang D.;Yi S.Foo S. W.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第4期
3.Preventing of Dewetting Effects for Inorganicndash;Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments

机译：Preventing of Dewetting Effects for Inorganicndash;Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments
- 作者：Uhlig S.;Domann G.;Houbertz R.Frohlich L.Schroder H.Krissler J.Lang G.Robertsson M.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第4期
4.Using Transmission Laser Bonding Technique for Line Bonding in Microsystem Packaging

机译：Using Transmission Laser Bonding Technique for Line Bonding in Microsystem Packaging
- 作者：Tseng A. A.;Park J.-S.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第4期
5.Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating

机译：Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating
- 作者：Kato T.;Akahoshi H.;Nakamura M.Hashimoto T.Nishimura A.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第4期
6.Acid Decapsulation of Epoxy Molded IC Packages With Copper Wire Bonds

机译：Acid Decapsulation of Epoxy Molded IC Packages With Copper Wire Bonds
- 作者：Murali S.;Srikanth N.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第3期
- Acid decapsulation;
- copper ball bonding;
- epoxy molding compounds (EMCs);
- thermosonic wire bonding;
- wet decapping;
7.Multiple Orders Per Job Compatible Batch Scheduling

机译：Multiple Orders Per Job Compatible Batch Scheduling
- 作者：Erramilli V.;Mason S. J.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第4期
8.Microstructure-Based Stress Modeling of Tin Whisker Growth

机译：Microstructure-Based Stress Modeling of Tin Whisker Growth
- 作者：Zhao J.-H.;Su P.;Ding M.Chopin S.Ho P. S.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第4期
9.Analysis of the Effects of Tin Whiskers at High Frequencies

机译：Analysis of the Effects of Tin Whiskers at High Frequencies
- 作者：Evans R.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第4期
10.Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance

机译：Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance
- 作者：Yueli Liu;Shyam Gale;R. Wayne Johnson
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
11.Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages

机译：Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages
- 作者：Tsung-Yueh Tsai;Chang-Lin Yeh;Yi-Shao LaiRong-Sheng Chen
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
12.Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux

机译：Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux
- 作者：Zhan S.;Azarian M.H.;Pecht M.G.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第3期
- Accelerated testing;
- conformal coating;
- contamination;
- dendrite;
- electrochemical migration;
- filament;
- no-clean flux;
- reliability;
- surface insulation resistance;
- temperature;
- 8211;
- humidity bias (THB);
- ele;
13.Crystallographic Texture and Whiskers in Electrodeposited Tin Films

机译：Crystallographic Texture and Whiskers in Electrodeposited Tin Films
- 作者：Asa Frye;George T. Galyon;Larry Palmer
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
14.A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages

机译：A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages
- 作者：Ahmer Syed;Seung Mo Kim;Wei LinJin Young KimEun Sook SohnJae Hyeon Shin
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
15.Insights Into Correlation Between Board-Level Drop Reliability and Package-Level Ball Impact Test Characteristics

机译：Insights Into Correlation Between Board-Level Drop Reliability and Package-Level Ball Impact Test Characteristics
- 作者：Chang-Lin Yeh;Yi-Shao Lai
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
16.Humidity Effects on Sn Whisker Formation

机译：Humidity Effects on Sn Whisker Formation
- 作者：Oberndorff P.;Dittes M.;Crema P.Su P.Yu E.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第4期
17.Length Distribution Analysis for Tin Whisker Growth

机译：Length Distribution Analysis for Tin Whisker Growth
- 作者：Yuki Fukuda;Michael Osterman;Michael Pecht
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
- heat treatment;
- tin;
- whiskers (crystal);
- Sn;
- brass substrate materials;
- length distribution analysis;
- tin finishes;
- tin whisker growth;
- Annealing;
- density;
- length;
- matte Sn;
- reflow;
- tin whiskers;
18.Foreword Special Section on Tin Whiskers

机译：Foreword Special Section on Tin Whiskers
- 作者：Ronald W. Gedney
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
19.A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests

机译：A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests
- 作者：Su P.;Howell J.;Chopin S.
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2006年第4期
20.Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Snndash;3.8Agndash;0.7Cu and Eutectic SnPb Solders

机译：Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Snndash;3.8Agndash;0.7Cu and Eutectic SnPb Solders
- 作者：Jin-Wook Jang;Ananda P. De Silva;James E. DryeSteve L. PostNorman L. OwensJong-Kai LinDarrel R. Frear
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
- ball grid arrays;
- copper alloys;
- failure analysis;
- impact testing;
- lead alloys;
- silver alloys;
- solders;
- tin alloys;
- Sn-Ag-Cu;
- SnPb;
- ball grid array package;
- bulk solder;
- drop impact test;
- failure morphology;
- strain rate sensitivity;
- under bump metallization interface;
- P;
21.Theory of Tin Whisker Growth: ldquo;The End Gamerdquo;

机译：Theory of Tin Whisker Growth: ldquo;The End Gamerdquo;
- 作者：Joe Smetana
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
- tin;
- whiskers (crystal);
- Sn;
- tin whisker growth;
- whisker growth oxidation;
- Lead free;
- Sn whiskers;
- reliability;
- tin alloys;
22.Sn Corrosion and Its Influence on Whisker Growth

机译：Sn Corrosion and Its Influence on Whisker Growth
- 作者：J. W. Osenbach;J. M. DeLucca;B. D. PotteigerA. AminR. L. ShookF. A. Baiocchi
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
23.Foreword Special Section on Drop Testing

机译：Foreword Special Section on Drop Testing
- 作者：Luu T. Nguyen
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期
24.Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling

机译：Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling
- 作者：Pradeep Lall;Sameep Gupte;Prakriti ChoudharyJeff Suhling
- 期刊名称：《IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society》 | 2007年第1期

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