首页> 外文会议>Silicon Carbide and Related Materials - 2005 pt.1; Materials Scinece Forum; vols.527-529 >Homoepitaxial Growth of iron-doped 4H-SiC using BTMSM and t-butylferrocene precursors for semi-insulating property
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Homoepitaxial Growth of iron-doped 4H-SiC using BTMSM and t-butylferrocene precursors for semi-insulating property

机译:使用BTMSM和叔丁基二茂铁前体同质外延生长掺铁4H-SiC,以实现半绝缘性

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In this paper, we attempted to grow semi-insulating SiC epitaxial layer by in-situ iron doping. Homoepitaxial growth of iron-doped 4H-SiC layer was performed by MOCVD using organo-silicon precursor, bis-trimethylsilylmethane (BTMSM, [C_7H_(20)Si_2]) and metal organic precursor, t-butylferrocene ([C_(14)H_(17)Fe]). Doping-induced crystallinity degradation showed different tendency depending on conducting type of substrate. The crystal quality of epilayer grown on n-type substrate was not degraded significantly despite of the Fe doping but in case of semi-insulating substrate, crystallinity was remarkably degraded as increasing iron contents. For measurement of resistivity of highly resistive iron-doped 4H-SiC epilayer, we used the on-resistance technique which is firstly attempted for measuring resistivity of epilayer. From on-resistance of epilayer measured by Ⅰ-Ⅴ, it is shown that the residual donor concentration of epilayer was decreased as increasing partial pressure of t-butylferrocene. The resistivity of iron-doped 4H-SiC epilayer was about 10~7 Ωcm. From this result, it is concluded that Fe could effectively act as a compensation center in the iron-doped 4H-SiC.
机译:在本文中,我们尝试通过原位铁掺杂生长半绝缘SiC外延层。使用有机硅前体,双三甲基硅烷基甲烷(BTMSM,[C_7H_(20)Si_2])和金属有机前体,叔丁基二茂铁([C_(14)H_( 17)Fe])。掺杂引起的结晶度降低显示出不同的趋势,这取决于衬底的导电类型。尽管掺杂了Fe,在n型衬底上生长的外延层的晶体质量并未显着降低,但是在半绝缘衬底的情况下,随着铁含量的增加,结晶度显着降低。为了测量高电阻的铁掺杂4H-SiC外延层的电阻率,我们使用了首次尝试用于测量外延层电阻率的导通电阻技术。从Ⅰ-Ⅴ测得的外延层的导通电阻可以看出,随着叔丁基二茂铁分压的增加,外延层的残余供体浓度降低。掺铁的4H-SiC外延层的电阻率约为10〜7Ωcm。从该结果可以得出结论,Fe可以有效地充当掺杂铁的4H-SiC中的补偿中心。

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