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Homoepitaxial growth and electrical characterization of iron-doped semi-insulating 4H-SiC epilayer

机译:掺铁半绝缘4H-SiC外延层的同质外延生长和电学表征

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The authors attempted to grow a semi-insulating silicon carbide (SiC) epitaxial layer by in situ iron doping. The homoepitaxial growth of the iron-doped 4H-SiC layer was performed by metal-organic chemical vapor deposition using the organo-silicon precursor bis(trimethylsilylmethane) (C_7H_(20)Si_2) and the metal-organic precursor t-butylferrocene (C_(14)H_(17)Fe). For the measurement of the resistivity of the iron-doped 4H-SiC epilayers, the authors used the on resistance of Schottky barrier diode. Based on the measurement of the on resistance, it is shown that the free carrier concentration was decreased with increasing partial pressure of t-butylferrocene. The resistivity of the iron-doped 4H-SiC epilayer was about 10~8 Ω cm.
机译:作者试图通过原位铁掺杂生长半绝缘碳化硅(SiC)外延层。通过使用有机硅前体双(三甲基甲硅烷基甲烷)(C_7H_(20)Si_2)和金属有机前体叔丁基二茂铁(C_( 14)H_(17)Fe)。为了测量铁掺杂的4H-SiC外延层的电阻率,作者使用了肖特基势垒二极管的导通电阻。基于导通电阻的测量,表明随着叔丁基二茂铁分压的增加,自由载流子浓度降低。掺铁的4H-SiC外延层的电阻率约为10〜8Ωcm。

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