Atomic Layer Deposition/Molecular Layer Deposition for Packaging and Interconnect of N/MEMS

摘要

Atomic layer deposition (ALD)/molecular layer deposition (MLD) processes are able to fabricate nano-scaled inorganic/organic multilayers. Such multilayers are essential to novel packaging and interconnect technologies for NEMS/MEMS. ALD/MLD coatings could reduce water vapor transmission rate down to 5X10"5 g/m2/day or lower for excellent hermetic/vacuum sealing. ALD/MLD coatings can also modify nanowireanomesh structures critical to flexible thermal ground planes that can reach an effective thermal conductivity of 30,000 W/mK and heat flux removal of 200 W/cm2. ALD/MLD coatings can enhance the stability while reducing thickness of an embedded Li-ion battery. In addition, the ALD/MLD-based inorganic/organic multilayer can be used for interconnecting nanowire-based photonics.