Solder material is used extensively in industry to attach eletronic componnents to circuit boards.This occurs via the reflow or wave soldering process where liquid solder is placed at the interface between the component leads and the boar.The shape that this volume of older takes is governed by the surface tension between the solder and its surrounding environment.This assembly then cools and the solder material solidifies and contracts,in the solid state,around its surroundings.Due to the thermal mis-match between the solder,lead and board,thermal stresses will evolve which can lead to cracks in the solder,hence expensive rework of the joint.Also such inbuilt stresses will restrict the working life of the joint.Computational models are now avaiable to predict the shape and solidification of solder joins,plus the evolving tresses in the joint and its surroundings in a coupled manner.This paper will discuss this modelling framework and its application to solder joint formation.
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