Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

Yao Peng; Li Xiaoyan; Jin Fengyang; Li Yang

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Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

机译：在电子包装中全CU3SN焊点形成期间CU3SN晶粒的形态转化

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摘要

Purpose - This paper aims to analyze the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging.

机译：目的 - 本文旨在在电子包装中全CU3SN焊点形成期间分析CU3SN谷物的形态转化。

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来源
《Soldering & Surface Mount Technology》 |2018年第1期|共12页
作者
Yao Peng; Li Xiaoyan; Jin Fengyang; Li Yang;
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作者单位

Beijing Univ Technol Beijing Peoples R China;

Beijing Univ Technol Beijing Peoples R China;

Beijing Univ Technol Beijing Peoples R China;

Beijing Univ Technol Beijing Peoples R China;

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原文格式 PDF
正文语种 eng
中图分类焊接一般性问题;
关键词
Cu3Sn grains; Electronic packaging; Full Cu3Sn solder joints; Morphology transformation;

机译：CU3SN谷物;电子包装;全CU3SN焊点;形态转型;

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专利

1. Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging [J] . Yao Peng, Li Xiaoyan, Jin Fengyang, Soldering & Surface Mount Technology . 2018,第1期

机译：在电子包装中全CU3SN焊点形成期间CU3SN晶粒的形态转化
2. Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing [J] . Tang Y., Luo S. M., Li Z. H., Journal of Electronic Materials . 2018,第10期

机译：在等温老化期间，低Ag Sn-0.3Ag-0.7Cu-XMN / Cu焊点界面Cu6Sn5和Cu3Sn5和Cu3Sn层的形态演化与生长动力学
3. Orientation transformation of Pb grains in 5Sn-95Pb/ 63Sn-37Pb composite flip-chip solder joints during electromigration test [J] . Ying-Ta Chiu, Kwang-Lung Lin, Yi-Shao Lai Journal of Materials Research . 2008,第7期

机译：电迁移测试中5Sn-95Pb / 63Sn-37Pb复合倒装芯片焊点中Pb晶粒的取向转变
4. A study on optimization of process parameters, microstructure evolution and fracture behavior for full Cu3Sn solder joints in electronic packaging [C] . Peng Yao, Xiaoyan Li, Xiaobo Liang, IEEE Electronics Packaging Technology Conference . 2016

机译：电子封装中全Cu3Sn焊点工艺参数，组织演变和断裂行为的优化研究
5. Grain structure evolution of tin-based lead-free solder joints in electronic packaging assembly and its impacts on the fatigue reliability. [D] . Xu, Huili. 2013

机译：电子包装组件中锡基无铅焊点的晶粒结构演变及其对疲劳可靠性的影响。
6. Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint [O] . Flora Somidin, Hiroshi Maeno, Xuan Quy Tran, 2018

机译：在焊点中单个Cu6Sn5晶粒中成像多态转变
7. Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints [O] . X. Deng, G. Piotrowski, J. J. Williams, 2003

机译：Cu-snO和Cu3sn金属间化合物初始形貌和厚度对sn-ag焊料/ Cu接头热老化过程中生长和演变的影响

Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

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