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Off-state stress degradation mechanism on advanced p-MOSFETs

机译:高级P-MOSFET上的断态应力退化机制

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Deep insights into the Off-State Stress (OSS) degradation mechanism on p-MOSFETs with High-K/Metal Gate technology are presented in this paper. Large subthreshold slope degradation, or positive Vth shift is observed in high, or low Vth devices, where both phenomena impact the off current degradation. The OSS degradation mechanism in pMOS is generated by (1) hot carrier generation close to the drain junction by impact ionization, then (2) hot electron injection into the oxide bulk defects, and (3) Si/oxide interface degradation. Both TCAD simulations and measurement with VGate-to-Drain modulation demonstrate the mechanism. The Vth shift in OSS is toward an opposite direction compared to CHC or BTI, which suggest a means to restore the Vth to the initial value after the OSS degradation.
机译:本文提出了对具有高k /金属栅极技术的P-MOSFET上的断开状态压力(OSS)降解机制的深度洞察。在高或低VTH器件中观察到大的亚阈值坡度劣化或正vth偏移,其中两个现象都影响了关闭电流降解。 PMOS中的OSS降解机制由(1)通过冲击电离,然后(2)热电子注射到氧化物堆积缺陷中,并进入(3)Si /氧化物界面劣化。 TCAD模拟和具有VGATE-排水调制的测量展示了该机制。与CHC或BTI相比,OSS中的VTH偏移是相反的方向,这表明在OSS降解之后将VTH恢复VTH的手段。

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