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Nickel induced lateral crystallization of amorphous silicon thin film transistor by arpid thermal anneal

机译:镍通过Arpid热退火诱导非晶硅薄膜晶体管的横向结晶

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We studied the RTA induced nickel promoted metal induced crystallization, MIC, of amorphous silicon. XRD data inducate that at 500 deg C crystallization commences after an incubation time of 4 minutes and is completed after 10 to 15 minutes. Thin film transistors, TFTs, fabricated with the MILC process had channel mobility o f 34 cm~2/Vs when processed at 560 deg C and 11 cm~2/Vs when processed at 620 deg C. The corresponding grain boundary trap densities were 4.8x10~(-2) cm~(-2) and 3.6x10~(13), respoectively.
机译:我们研究了RTA诱导的镍促进的金属诱导的结晶,MIC,非晶硅。 XRD数据诱导,在500℃下结晶在孵育时间4分钟后开始,并在10至15分钟后完成。薄膜晶体管,用MILC工艺制造的TFT,当在620℃加工时在560℃和11cm〜2 / Vs下加工时,具有34cm〜2 / Vs的通道迁移率。相应的晶粒边界陷阱密度为4.8x10 〜(-2)cm〜(-2)和3.6x10〜(13),重新检查。

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