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1-D and 2-D hot carrier layout optimization of N-LDMOS transistor arrays

机译:N-LDMOS晶体管阵列的一维和二维热载流子布局优化

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Today's power management devices often require operation in the 20-30 V range. These applications often combine a high performance BiCMOS process with a power lateral DMOS (LDMOS) driver. To obtain high drive current density and minimal on-resistance (Rdson), LDMOS devices are often implemented in transistor arrays. Because of the high voltages and currents applied to these LDMOS arrays hot carrier (HC) degradation is a real reliability concern. This paper focuses on improving the HC reliability of N-LDMOS transistor arrays. Layout optimization is emphasized since the LDMOS and Bipolar/CMOS devices share common process steps. This paper differs from previous work in that it discusses for the first time the one- and two-dimensional aspects of LDMOS transistor array layout on HC performance. In addition this paper introduces for the first time a novel LDMOS transistor layout featuring a Drain Ring that dramatically improves the HC performance of these arrays.
机译:当今的电源管理设备通常需要在20-30 V的范围内工作。这些应用通常将高性能BiCMOS工艺与功率横向DMOS(LDMOS)驱动器结合在一起。为了获得高驱动电流密度和最小导通电阻(Rdson),通常在晶体管阵列中实现LDMOS器件。由于施加到这些LDMOS阵列的高电压和高电流,热载流子(HC)的降级是真正的可靠性问题。本文着重于提高N-LDMOS晶体管阵列的HC可靠性。由于LDMOS和Bipolar / CMOS器件共享共同的工艺步骤,因此强调了布局优化。本文与先前的工作不同之处在于,它首次讨论了LDMOS晶体管阵列布局的一维和二维方面与HC性能的关系。此外,本文首次介绍了具有漏极环的新型LDMOS晶体管布局,该布局可显着提高这些阵列的HC性能。

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