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A multi-chip packaged GaAs 16×16 bit parallel multiplier

机译:多芯片封装GaAs 16×16位并行乘法器

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A GaAs 16×16 16-bit parallel multiplier utilizing multichippackaging technology is demonstrated. This multichip approach was takenin an effort to realize GaAs ULSIs with high yield and reliability,using multiple smaller scale integrated circuits. The device is composedof four GaAs 8×8-bit expandable parallel multipliers and amultichip package (MCP). The developed 8×8 multipliers consist of1097 enhancement/depletion DCFL (directly coupled FET logic) gates each,and have a 3.4 ns multiplication time. The developed MCP is composed offive layers of alumina ceramic which include 50 Ω striplines. Themultiplication time of this 16×16-bit multichip multiplier is 7.6ns, and the total production yield is 70%
机译:利用多芯片的GaAs 16×16 16位并行乘法器 包装技术得到了证明。采取了这种多芯片方法 为了实现高成品率和可靠性的GaAs ULSI, 使用多个较小规模的集成电路。设备组成 四个GaAs 8×8位可扩展并行乘法器和一个 多芯片封装(MCP)。开发的8×8乘法器包括 每个1097增强/耗尽DCFL(直接耦合FET逻辑)门, 并具有3.4 ns的乘法时间。研发的MCP由以下部分组成: 五层氧化铝陶瓷,其中包括50Ω带状线。这 此16×16位多芯片乘法器的乘法时间为7.6 ns,总产量为70%

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