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A multichip packaged GaAs 16*16 parallel multiplier

机译:多芯片封装的GaAs 16 * 16并行乘法器

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摘要

A GaAs 16*16 bit parallel multiplier utilizing multichip packaging technology is demonstrated. This multichip approach is undertaken in an effort to realize GaAs ULSIs with high yield and reliability, using multiple smaller scale integrated circuits. The device is composed of four GaAs 8*8 expandable parallel multipliers and a multichip package (MCP). The developed 8*8 b multipliers consist of 1097 E/D DCFL gates each and have a 2.4-ns multiplication time. The developed MCP is composed of five layers of alumina ceramic which include 50- Omega strip lines. The multiplication time of this 16*16 b multichip multiplier is 7.6 ns, and the total production yield is 70%.
机译:演示了利用多芯片封装技术的GaAs 16 * 16位并行乘法器。采取这种多芯片方法的目的是使用多个较小规模的集成电路来实现具有高良率和可靠性的GaAs ULSI。该器件由四个GaAs 8 * 8可扩展并行乘法器和一个多芯片封装(MCP)组成。开发的8 * 8 b乘法器每个由1097个E / D DCFL门组成,并具有2.4ns的乘法时间。开发的MCP由五层氧化铝陶瓷组成,其中包括50条Omega带状线。该16 * 16 b多芯片乘法器的乘法时间为7.6 ns,总产量为70%。

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