首页> 外文会议>Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International >Interface trap induced thermionic and field emission current inoff-state MOSFET's
【24h】

Interface trap induced thermionic and field emission current inoff-state MOSFET's

机译:界面陷阱引起的热电子和场发射电流断态MOSFET

获取原文

摘要

An interface trap-assisted tunneling and thermionic emission modelhas been developed to study an increased drain leakage current inoff-state MOSFET's after hot carrier stress. In the model, a completeband-trap-band leakage path is formed at the Si-SiO2interface by hole emission from interface traps to the valence band andelectron emission from interface traps to the conduction band. Both holeand electron emissions are carried out via quantum tunneling or thermalexcitation. In experiment, a 0.5 μm n-MOSFET was subject to hotcarrier stress to generate interface traps. The drain leakage currentwas characterized to compare with the model. Our study reveals that theinterface trap-assisted two-step tunneling, hole tunneling followed byelectron tunneling, is responsible for the leakage current at a largedrain-to-gate bias (Vdg) The lateral field plays a dominantrole in the two-step tunneling process. As Vdg decreases, athermionic-field emission mechanism, hole thermionic emission andelectron tunneling, becomes a primary leakage path. At a sufficientlylow Vdg, our model reduces to the Shockley-Read-Hall theoryand thermal generation of electron hole pairs through traps is dominant
机译:接口陷阱辅助隧道和热离子发射模型 已经开发出研究漏极泄漏电流增加 热载波应力后的偏离状态MOSFET。在模型中,一个完整的 带阱带泄漏路径在Si-SiO 2 上形成 界面从界面陷阱到价带的界面发射 从界面陷阱到导通带的电子发射。孔 电子发射通过量子隧道或热量进行 励磁。在实验中,0.5μmn-MOSFET经过热量 载波应力生成界面陷阱。排水漏电流 被表征与模型进行比较。我们的研究表明 接口陷阱辅助两步隧道,孔隧道随后 电子隧道,负责大量漏电流 横向场散流偏置(V dg )扮演主导 在两步隧道过程中的作用。随着v dg 减少,a 热处理场排放机构,孔热量发射和 电子隧道,成为主要泄漏路径。齐心协力 低V dg ,我们的模型减少到Shockley-Read-Hall理论 通过陷阱的电子孔对热产生是显性的

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号