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Elastomers for control of wafer temperature in the ≈50°C range during high dose ion implantation

机译:高剂量离子注入过程中用于将晶圆温度控制在≈50°C范围内的弹性体

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Wafer/pad temperatures are measured for various elastomer materials for control of wafer temperatures during high-power implantation to less than 40 C. Wafer/pad temperatures during and directly following implant are monitored by in-situ IR sensors and tracked over long operational cycles. Beneficial effects of wafer temperature control is noted for gain characteristics of modern IC devices.
机译:测量各种弹性体材料的晶圆/焊盘温度,以将大功率注入期间的晶圆温度控制在40°C以下。通过原位红外传感器监控注入过程中和注入后的晶圆/焊盘温度,并跟踪较长的工作周期。注意到晶片温度控制的有益作用是现代IC器件的增益特性。

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