ASSEMBLY AND RELIABILITY STUDIES ON REWORKED AND NON-REWORKED QFN PACKAGES

摘要

Quad Flat No lead (QFN) packages are being used as alternative components to some of the large form-factor packages due to their smaller footprint, improved thermal and electrical performance. During the past few years, there has been a surge of published papers by end users and component manufacturers on the topic of assembly and reliability of the QFN packages. Both empirical and simulation data has been published, which has helped several manufacturers to develop design guidelines and assembly processes for these packages. There exists a gap in the current published work on the assembly and reliability of high I/O count QFNs on thick boards. In addition, reliability of the rework process on QFNs is not well documented.