Quad flat no-lead (QFN) chip package assembly apparatus and method
展开▼
机译:四方扁平无引线(QFN)芯片封装组装设备和方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
In one embodiment the present invention includes a method of fabricating a quad flat no-lead (QFN) chip package. The method includes forming a stamped lead frame; forming a die pad and a lead shrink on one side of the stamped lead frame; mounting a die on the die pad; performing wire bonding; encapsulating the die and the wire bond with a molding compound; removing the stamped lead frame after encapsulating; and sawing the molding compound after the stamped lead frame has been removed. Such method results in improved quality of wire leads, improved lifespan of cutting blades, and reduction of burrs as compared to many existing methods of fabricating QFN chip packages.
展开▼