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The relationship of life prediction for quad flat no-lead package (QFN) packages using 4 point cyclic bend testing and thermal cycle testing

机译：使用四点循环弯曲测试和热循环测试的四方扁平无铅封装（QFN）封装的寿命预测之间的关系

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作者
Mohan, Monisha;
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作者单位

The University of Texas at Arlington;

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授予单位 The University of Texas at Arlington;
学科
学位 M.S.M.E.
年度 2015
页码 55 p.
总页数 55
原文格式 PDF
正文语种 eng
中图分类
关键词
入库时间 2022-08-17 11:57:33

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专利

1. The Effect of Leadframe Oxidation of a Quad Flat No-Lead Semiconductor Package under Cyclic Loading [J] . Shahrum Abdullah, Mohamad Faizal Abdullah, Ahmad Kamal Ariffin Journal of Applied Sciences . 2008,第9期

机译：循环载荷下四方扁平无铅半导体封装的引线框氧化效应
2. Prediction of Delamination Failure in Quad Flat No-Lead Packages Using Combined Experimental and Simulation Methods [J] . Wu Mei-Ling, Lan Jia-Shen Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2021,第5期

机译：采用组合实验和仿真方法预测四边形无铅封装中的分层失效
3. Analytical thermal resistance model for calculating mean die temperature of eccentric quad flat no-leads packaging on printed circuit board [J] . Yongchao Wang, Xin Wei, Guohao Zhang, AIP Advances . 2021,第3期

机译：印刷电路板上偏心四扁平无铅封装平均压模的分析热阻模型
4. The relationship of life prediction between cyclic bending and thermal cycle testing on CSP package [C] . Chuan-Chun Chang Graver, Chi-Ko Yu, Shao Tina, 2010 11th International Conference on Electronic Packaging Technology High Density Packaging . 2010

机译：CSP封装的寿命预测与循环弯曲和热循环测试之间的关系
5. Investigation and Analysis on Hygrothermal Failure in Quad Flat No-lead (QFN) Packages. [D] . Zhang, Minshu. 2010

机译：四方扁平无铅（QFN）封装中的湿热失效调查和分析。
6. Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling [O] . Chaobo Shen, Zhou Hai, Cong Zhao, 2017

机译：在长期老化和循环下的板级热测试中ENIG和ENEPIG表面处理的包装可靠性影响
7. The Destruction Mode and the Life Cycle Times of the Chip Size Package Mounted on the Circuit Board by the Bending Test. [O] . Hironori OHTA, Yuuki MOMOKAWA, Eiichi KOUNO, 2001

机译：通过弯曲测试安装在电路板上的芯片尺寸封装的破坏模式和寿命周期时间。
8. Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability. [R] . Ghaffarian, R. 2014

机译：知识体系（BOK）用于无引线四方扁平无引线/底部端接元件（QFN / BTC）封装趋势和可靠性。

The relationship of life prediction for quad flat no-lead package (QFN) packages using 4 point cyclic bend testing and thermal cycle testing

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