Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method

摘要

正This paper describes a method to extract electrical parameters of the through via in Package-on-Package(PoP)with interposer.Using the de-embedding technique electrical parameters of the through via are extracted.With the extracted electrical parameters of the through via,the effects of via height,the distance between signal and GND vias,and anti-pad clearance on the electrical characteristics are discussed. parameter extraction;de-embedding; Package-on-Package(PoP)