The implementation of differential Pirani gauge for accurately measuring wafer-level package pressures was demonstrated. We proposed a multiple-sensor-solution, where two Pirani gauges were constructed under different pressures; one in sealed micro-cavity for measuring pressures and the other one in opened micro-cavity as a reference. Ambient pressure, structural dimension variations, and resistivity differences among wafers/lots, were captured through the differential scheme for error compensations, allowing accurate pressure determinations. Presented Pirani utilized small gaps (~2μm) between heater and dual heat sinks to obtain wide operation range (0.05~100 Torr) and high sensitivity (~10000 ppm/Torr). With 5X error reductions and high stabilities, the proposed device was successfully used in examining reliabilities and monitoring processes of wafer-level packages.
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