Vibrational fatigue calculation-process for solder joints with FEMFAT spectral

机译：具有Femfat光谱的焊接接头的振动疲劳计算过程

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A simulation process for the vibrational fatigue analysis of solder joints is presented. The process is built around the software FEMFAT spectral and consists of three core technologies: semi-automatic generation of substitute finite-element-models (FE-mo

机译：介绍了焊点振动疲劳分析的模拟过程。该过程围绕软件Femfat谱而构建，包括三种核心技术：半自动生成替代有限元模型（Fe-Mo

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《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》|2020年|395p|共8页
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Harald Ziegelwanger; Walter Hinterberger;
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中图分类自动模拟理论（自动仿真理论）;
关键词
Pins; Soldering; Fatigue; Static analysis; Solid modeling; Databases;

机译：销;焊接;疲劳;静态分析;实体建模;数据库;

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专利

1. Solder joint accelerated test reliability requirements - a bad example: Specifying solder joint reliability requirements requires understanding of solder creep-fatigue behavior [J] . Werner Engelmaier Global SMT & Packaging: European Edition (Surface Mount Technology) . 2011,第4期

机译：焊点加速测试可靠性要求-一个不好的例子：指定焊点可靠性要求需要了解焊锡蠕变疲劳行为
2. Comparison of fatigue life prediction methods for solder joints under random vibration loading [J] . Xia Jiang, Yang Lin, Liu Qunxing, Microelectronics & Reliability . 2019,第APRa期

机译：随机振动载荷下焊点疲劳寿命预测方法的比较
3. Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module [J] . Ghaderi Davood, Pourmahdavi Maryam, Samavatian Vahid, Proceedings of the institution of mechanical engineers . 2019,第9期

机译：热循环和振动负荷的组合对功率模块中焊点的疲劳寿命的影响
4. Vibrational fatigue calculation-process for solder joints with FEMFAT spectral [C] . Harald Ziegelwanger, Walter Hinterberger International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2020

机译：FEMFAT光谱的焊点振动疲劳计算过程
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019

机译：使用Sn纳米粒子增强焊膏焊接无源部件：对微观结构和关节强度的影响
7. Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations [O] . Libot Jean-Baptiste, Arnaud Lionel, Dalverny Olivier, 2016

机译：SAC305焊点在谐波振动下的机械疲劳评估
8. Microstructural Observations of the Sn-Pb Solder/Cu System and Thermal Fatigue of the Solder Joint [R] . Frear, D. R. 1987

机译：sn-pb焊料/ Cu系统的微观结构观察及焊点的热疲劳

Vibrational fatigue calculation-process for solder joints with FEMFAT spectral

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