Comparison of fatigue life prediction methods for solder joints under random vibration loading

摘要

The fatigue life prediction of solder joints under random vibration load is one of the most important aspect in design of packaging. A fatigue-life estimation in the frequency domain is proved to have advantages in comparison to the time-domain estimation. This paper presents a comparison of the fatigue life prediction of solder joints under random vibration load by several popular frequency domain methods, including the narrow-band, the Wirsching-Light, the single-moment, the Empirical alpha(0.75), the Tovo-Benasciutti, the Zhao-Baker, and the Dirlik methods. The comparison between these selected frequency domain methods and the traditional Steinberg method was investigated with the help of the relative error. Results indicate that most spectral methods are accurate than the Steinberg method, the Tovo-Benasciutti method is proved to be the best method for the life estimation of solder joints suited not only to the BGA package but also to the PoP package.