The connection union null Cu which uses the resistance fatigue Characteristic joined with solder material and the said jointing material which include the unleaded solder alloy and the said

摘要

PPROBLEM TO BE SOLVED: To provide a low-silver based lead-free solder alloy which has excellent wetting properties and excellent thermal fatigue characteristics, to provide a solder-paste type soldering material and a flux-cored soldering material which exhibit excellent fatigue resistance, and to provide joined products using the soldering materials. PSOLUTION: The low-silver based lead-free solder alloy contains, by weight, 0.1 to 1.5% Cu, 0.01 to less than 0.05% Co, 0.05 to 0.25% Ag, and 0.001 to 0.008% Ge with the balance Sn. The soldering materials are prepared either by mixing a low-silver based lead-free solder alloy with a pasty flux, or by forming the solder alloy into a wire shape with a solid or pasty flux as the core. PCOPYRIGHT: (C)2010,JPO&INPIT